Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)最新文献_第3页

Self-crystallization and reduced contact resistivity by hot phosphorus ion implant in germanium-tin alloy 热磷离子注入锗锡合金的自晶化及降低接触电阻率

Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) Pub Date : 2014-04-28 DOI: 10.1109/VLSI-TSA.2014.6839659

Lanxiang Wang, B. Liu, X. Gong, P. Guo, Qian Zhou, L. Chua, W. Zou, C. Hatem, T. Henry, Y. Yeo

引用次数: 1

Electron ballistic current enhancement of Ge1−xSnx FinFETs Ge1−xSnx finfet的电子弹道电流增强

Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) Pub Date : 2014-04-28 DOI: 10.1109/VLSI-TSA.2014.6839656

H. Lan, C. W. Liu

引用次数: 0

Foundry RF technologies 代工射频技术

Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) Pub Date : 2014-04-28 DOI: 10.1109/VLSI-TSA.2014.6839703

P. R. Verma, Z. Shaoqiang, C. K. Wai, Tan Juan Boon, R. Nair

引用次数: 1

Scaling properties of perpendicular MTJ with dual-CoFeB/MgO interfaces and step-etch structure 双cofeb /MgO界面和阶梯蚀刻结构垂直MTJ的标化性能

Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) Pub Date : 2014-04-28 DOI: 10.1109/VLSI-TSA.2014.6839662

C. Chien, Ding-Yeong Wang, Sheng-Huang Huang, K. Shen, Shan-Yi Yang, J. Shyu, Keng-Ming Kuo, Young-Shying Chen, Yung-Hung Wang, T. Ku, D. Deng

引用次数: 1

Impact of channel doping on the device and NBTI performance in FinFETs for low power applications 通道掺杂对低功耗finfet器件和NBTI性能的影响

Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) Pub Date : 2014-04-28 DOI: 10.1109/VLSI-TSA.2014.6839654

A. Sachid, C. Hu

引用次数: 1

Roadway to innovation 创新之路

Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) Pub Date : 2014-04-28 DOI: 10.1109/VLSI-TSA.2014.6839630

Ronald M. Martino

{"title":"Roadway to innovation","authors":"Ronald M. Martino","doi":"10.1109/VLSI-TSA.2014.6839630","DOIUrl":"https://doi.org/10.1109/VLSI-TSA.2014.6839630","url":null,"abstract":"Electronic innovation is becoming increasingly more important in the evolution of our society. Noble goals of extending healthy lives with improving medical capabilities, creating a cleaner environment, eliminating auto fatalities, and creating a connected infrastructure around the “Internet of Things” all center on electronic innovation. These goals are being driven by both legislation and consumer demand, which is leading to accelerated system challenges driving a strong need for integration of disparate functional blocks and exponential scaling of content. A central focus in this evolution is the automobile. Emission standards are driving systems from single core, simple computational units to highly integrated, scaled out, safe and secure domain controllers, which host multiple diverse software environments. Shifts toward autonomous driving are leading to integrated sensing systems leveraging advanced algorithms for detection classification and safe decision making. The strong demand for connected vehicles is resulting in revolutionary changes to the vehicle network and communication infrastructure embedded in the automobile. We will explore how these automotive trends translate to future challenges for technology platforms, integrated circuit module development, system-on-chip integration, design of safe systems, and implementation of secure but diagnosable systems.","PeriodicalId":403085,"journal":{"name":"Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121675556","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Investigation of radiation hardness of HfO2 resistive random access memory HfO2电阻式随机存取存储器辐射硬度的研究

Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) Pub Date : 2014-04-28 DOI: 10.1109/VLSI-TSA.2014.6839675

B. Tsui, Ko-Chin Chang, B. Shew, Heng-Yuan Lee, M. Tsai

引用次数: 3

Self-convergent trimming of embedded logic compatible OTP memory for VT variation reduction in low voltage SRAMs 嵌入式逻辑兼容OTP存储器的自收敛微调，用于降低低压sram的VT变化

Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) Pub Date : 2014-04-28 DOI: 10.1109/VLSI-TSA.2014.6839666

Sheng-Yen Chien, P. Lin, Hung-Yu Chen, C. Lin, Y. King

引用次数: 1

High-density nano-pillar SiOx-based resistive switching memory using nano-sphere lithography to fabricate a one diode - one resistor (1D-1R) architecture 高密度纳米柱siox基阻性开关存储器采用纳米球光刻技术制造出一二极管一电阻(1D-1R)结构

Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) Pub Date : 2014-04-28 DOI: 10.1109/VLSI-TSA.2014.6839674

Y. F. Chang, L. Ji, Y. Chen, F. Zhou, T. Tsai, K. Chang, M. Chen, T. Chang, B. Fowler, E. Yu, J. Lee

引用次数: 2

More than Moore foundry: Challenges for process technology, process characterization and design enablement to address complex cyber physical systems in harsh environments 超越摩尔铸造厂:工艺技术、工艺表征和设计实现的挑战，以解决恶劣环境下复杂的网络物理系统

Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) Pub Date : 2014-04-28 DOI: 10.1109/VLSI-TSA.2014.6839699

Steven Chen

{"title":"More than Moore foundry: Challenges for process technology, process characterization and design enablement to address complex cyber physical systems in harsh environments","authors":"Steven Chen","doi":"10.1109/VLSI-TSA.2014.6839699","DOIUrl":"https://doi.org/10.1109/VLSI-TSA.2014.6839699","url":null,"abstract":"Summary form only given. This presentation focuses on More than Moore technologies - the integration of additional features in digital CMOS technologies. Such additional features include high-voltage transistors with operating voltages up to 200V; non-volatile memories for trimming, program and data storage; and sensors for pressure or magnetic flux measurements. Complexity even increases when the circuit is operated in harsh environments with temperatures up to 175 degrees C. The covered application space spans motion and gesture sensing in today's mobile devices; automotive applications such as alternators, controllers for brushless DC electric motor with LIN or CAN interfaces as well as medical applications such as ultrasonic transducer arrays. Ideally, design engineers are able to achieve all of their design targets with a minimal number of iterations or even at first silicon to reduce time to market. The talk will help engineers understand the complexity of their designs and provide guidance on how to achieve their design targets. This presentation describes how to identify the right process technology, process characterization requirements in the context of high-temperature operations, and multiple design challenges such as ESD robustness, die size constraints, low noise and low power, and high reliability.","PeriodicalId":403085,"journal":{"name":"Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129711821","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1