More than Moore foundry: Challenges for process technology, process characterization and design enablement to address complex cyber physical systems in harsh environments

Abstract

Summary form only given. This presentation focuses on More than Moore technologies - the integration of additional features in digital CMOS technologies. Such additional features include high-voltage transistors with operating voltages up to 200V; non-volatile memories for trimming, program and data storage; and sensors for pressure or magnetic flux measurements. Complexity even increases when the circuit is operated in harsh environments with temperatures up to 175 degrees C. The covered application space spans motion and gesture sensing in today's mobile devices; automotive applications such as alternators, controllers for brushless DC electric motor with LIN or CAN interfaces as well as medical applications such as ultrasonic transducer arrays. Ideally, design engineers are able to achieve all of their design targets with a minimal number of iterations or even at first silicon to reduce time to market. The talk will help engineers understand the complexity of their designs and provide guidance on how to achieve their design targets. This presentation describes how to identify the right process technology, process characterization requirements in the context of high-temperature operations, and multiple design challenges such as ESD robustness, die size constraints, low noise and low power, and high reliability.