A. Lombrez , A. Divay , H. Boutry , L. Colas , N. Coudurier , S. Altazin , T. Baron
{"title":"TLM-based numerical extraction for CMOS-compatible N+-InGaAs ohmic contacts on 200mm Si substrates","authors":"A. Lombrez , A. Divay , H. Boutry , L. Colas , N. Coudurier , S. Altazin , T. Baron","doi":"10.1016/j.sse.2025.109112","DOIUrl":"10.1016/j.sse.2025.109112","url":null,"abstract":"<div><div>We report the results of a TLM-based numerical extraction methodology applied on CMOS-compatible N<sup>+</sup>-InGaAs ohmic contacts integrated with dielectrics on 200mm Si substrates. The methodology is first described and calibrated using contacts on SOI. Then, we applied this method on W/TiN/Ti on N<sup>+</sup>-InGaAs contacts to obtain state-of-the-art level ρ<sub>c</sub> = 7,5.10<sup>-8</sup> Ω.cm<sup>2</sup> for 0.35x0.35µm contact dimension, which is close to relevant contact size of the targeted application (THz HBT for 6G).</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"227 ","pages":"Article 109112"},"PeriodicalIF":1.4,"publicationDate":"2025-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143817080","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Talha Chohan , Zhixing Zhao , Luca Pirro , Loren Dombroske , Jacob Ong , Olaf Zimmerhackl , Steffen Lehmann , David Pritchard , Tao Xue , Jan Hoentschel
{"title":"Substrate crosstalk characterization for optimized isolation in FDSOI","authors":"Talha Chohan , Zhixing Zhao , Luca Pirro , Loren Dombroske , Jacob Ong , Olaf Zimmerhackl , Steffen Lehmann , David Pritchard , Tao Xue , Jan Hoentschel","doi":"10.1016/j.sse.2025.109117","DOIUrl":"10.1016/j.sse.2025.109117","url":null,"abstract":"<div><div>The coupling (crosstalk) between devices through substrate is a limiting factor for the highly integrated mixed-mode and high frequency circuits. Silicon–On–Insulator<!--> <!-->(SOI) wafer with buried oxide (BOX) inherits better low frequency isolation compared to bulk silicon. However, at higher frequencies the advantage subsides due to capacitive coupling. For the mixed mode applications, the abrupt signal switching in digital circuitry poses a detrimental effect on the noise-sensitive analog circuitry. This work studies the crosstalk isolation in commercial SOI resistivity substrate (∼1–100 Ω.cm) by deploying design-based approaches for crosstalk reduction. A clear advantage of SOI vs standard bulk is reported especially for low-frequency range. Substrate well variance with different types of junctions is studied and demonstrated to reduce noise isolation. Moreover, a novel guard-ring scheme deploying the combination of resistive and capacitive elements has shown to have improvement in the noise isolation for wide band applications compared to the individual elements.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"227 ","pages":"Article 109117"},"PeriodicalIF":1.4,"publicationDate":"2025-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143761074","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Michelly de Souza , Jaime Calçade Rodrigues , Lucas Mota Barbosa da Silva , Flavio Enrico Bergamaschi , Mikaël Cassé , Sylvain Barraud , Olivier Faynot , Marcelo Antonio Pavanello
{"title":"Analysis of electron mobility in 7-level stacked nanosheet GAA nMOSFETs","authors":"Michelly de Souza , Jaime Calçade Rodrigues , Lucas Mota Barbosa da Silva , Flavio Enrico Bergamaschi , Mikaël Cassé , Sylvain Barraud , Olivier Faynot , Marcelo Antonio Pavanello","doi":"10.1016/j.sse.2025.109115","DOIUrl":"10.1016/j.sse.2025.109115","url":null,"abstract":"<div><div>In this study, an experimental assessment of transport parameters in 7-level stacked nanosheet GAA nMOSFETs is conducted, employing the Y-Function methodology to extract carrier mobility. Specifically, the contribution of horizontal and vertical conduction planes to mobility and degradation factors is investigated for transistors with varying channel lengths and nanosheet widths. The findings reveal that while overall low-field mobility demonstrates weak dependency on nanosheet width, it suffers some reduction in short-channel transistors. Furthermore, the mobility degradation was analyzed, and the results indicate that overall mobility degradation coefficients depend on the nanosheet width, as the balance between horizontal and vertical contributions varies. Notably, while the linear degradation factor dominates the mobility degradation at horizontal planes, vertical planes exhibit a dominant quadratic degradation factor. This suggests larger surface roughness scattering at sidewalls compared to horizontal planes.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"227 ","pages":"Article 109115"},"PeriodicalIF":1.4,"publicationDate":"2025-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143785792","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Miltiadis K. Nakos , Andreas Tsormpatzoglou , Dimitrios H. Tassis , Theodoros A. Oproglidis , Constantinos T. Angelis , Charalabos A. Dimitriadis
{"title":"Analytical modeling of nanoscale double-gate junctionless transistors comprising the impact of the source and drain underlap regions","authors":"Miltiadis K. Nakos , Andreas Tsormpatzoglou , Dimitrios H. Tassis , Theodoros A. Oproglidis , Constantinos T. Angelis , Charalabos A. Dimitriadis","doi":"10.1016/j.sse.2025.109105","DOIUrl":"10.1016/j.sse.2025.109105","url":null,"abstract":"<div><div>In this study, we investigate the impact of the source and drain (S/D) underlap regions on the electrical characteristics of short-channel double-gate junctionless transistors (DG JLTs). Analytical expression for the potential distribution in the gate overlap and S/D underlap regions is introduced, which relies on a single fitting parameter and the gate fringe capacitance in the underlap regions. The derived potential distribution shows good agreement with simulation results across different underlap lengths and gate/drain bias voltages. Consequently, new expressions for the threshold voltage and the subthreshold swing coefficient of DG JLTs are developed comprising the effect of the S/D underlap regions, which are used for upgrading our previous continuous and symmetric analytical drain current compact model. The findings highlight the significant influence of the S/D underlap regions on the electrical characteristics of DG JLTs, suggesting a need for their careful consideration in drain current compact modeling.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"227 ","pages":"Article 109105"},"PeriodicalIF":1.4,"publicationDate":"2025-03-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143725758","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Soumya Ranjan Panda , Thomas Zimmer , Anjan Chakravorty , Sebastien Fregonese
{"title":"Recent progress in bipolar and heterojunction bipolar transistors on SOI","authors":"Soumya Ranjan Panda , Thomas Zimmer , Anjan Chakravorty , Sebastien Fregonese","doi":"10.1016/j.sse.2025.109101","DOIUrl":"10.1016/j.sse.2025.109101","url":null,"abstract":"<div><div>This article discusses the intricate advancements in lateral bipolar transistors (LBJT) and devices based on silicon germanium (SiGe) lateral hetero-junction bipolar transistors (LHBT). The paper also addresses the developments in vertical SiGe HBTs, and the challenges encountered in fabricating vertical devices on SOI substrates and demonstrates how these hurdles can be mitigated through lateral device technology. Owing to their compatibility with the complementary metal–oxide–semiconductor (CMOS) field effect transistor (FET) process and their appealing prospects in mixed-signal radio frequency applications, SiGe HBT devices remain a compelling choice. Integrating silicon-on-insulator (SOI) substrates eliminates parasitic components, rendering it to be an attractive option when coupled with SiGe HBT technology. This article explores various SOI-based lateral devices, elucidating their architectures and performance characteristics. It notably underscores our recent endeavors concerning the 28 nm fully-depleted SOI (FDSOI)-based SiGe HBT.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"227 ","pages":"Article 109101"},"PeriodicalIF":1.4,"publicationDate":"2025-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143696924","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Yash N. Doshi , Dixita S. Parmar , Ajay D. Zanpadiya , Aditi P. Pathak , Divya R. Solanki , Dimple V. Shah , Vishva M. Jain , Hiren N. Desai , Piyush B. Patel
{"title":"Expanding the potential of Zn0.15Sn0.85(Se0.95S0.05)2 crystals for applications in near-infrared optoelectronics, sensing, and Van der Waals heterojunctions","authors":"Yash N. Doshi , Dixita S. Parmar , Ajay D. Zanpadiya , Aditi P. Pathak , Divya R. Solanki , Dimple V. Shah , Vishva M. Jain , Hiren N. Desai , Piyush B. Patel","doi":"10.1016/j.sse.2025.109104","DOIUrl":"10.1016/j.sse.2025.109104","url":null,"abstract":"<div><div>Layered Zn<sub>0.15</sub>Sn<sub>0.85</sub>(Se<sub>0.95</sub>S<sub>0.05</sub>)<sub>2</sub> (Q2) crystals with a hexagonal crystalline structure were grown using the direct vapor transport technique (DVT). This research explores applications of the grown Q2 crystals as a near-infrared (NIR) photodetector, vacuum pressure sensor, and Van der Waals heterojunction. The NIR photodetector demonstrating stable, rapid switching with an improved responsivity of 153.38 mAW<sup>-1</sup>. A Q2 crystal-based NIR photodetector achieves an external quantum efficiency of 21.17 %. The Maxwellian distribution was applied to analysis trap depth of NIR photodetector. Additionally, the pulse resistive response of the Q2 crystal-based vacuum pressure sensor was evaluated across a vacuum pressure range from −1033 mbar to 0 mbar. The sensor exhibited a stable response, with 61.27 % at −1033 mbar and 5.85 % at −133 mbar with an average delay time of 2.99 s. Furthermore, the Van der Waals heterojunction device formed by the grown p-type Q2 crystals with another n-type quaternary crystal was studied using the thermionic-emission (TE) model. The ideality factors have been defined in the range of 1 to 2 by studying the current voltage (I-V) characteristics under different temperatures.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"226 ","pages":"Article 109104"},"PeriodicalIF":1.4,"publicationDate":"2025-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143642555","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Qingxue Zhao , Shenwei Wang , Zhengmao Wen , Weifang Zhang , Xiaoxia Duan , Lixin Yi
{"title":"Intense near-infrared electroluminescence properties from ZnO:Yb LED","authors":"Qingxue Zhao , Shenwei Wang , Zhengmao Wen , Weifang Zhang , Xiaoxia Duan , Lixin Yi","doi":"10.1016/j.sse.2025.109102","DOIUrl":"10.1016/j.sse.2025.109102","url":null,"abstract":"<div><div>Rare-earth (RE) doped zinc oxide electroluminescence is worthy of study due to its pure and sharp luminescence characteristics. In this work, we report ZnO:Yb light-emitting diodes (LED) and test their electroluminescence properties. Through adjusting the concentration of ytterbium doping and optimizing of annealing parameters for ZnO:Yb thin films, the results show that ZnO:Yb light-emitting diodes are capable of generating intense near-infrared emission at 975 nm and 1004 nm. We contend that impact excitation is the predominant mechanism underlying the electroluminescence in ITO/PEDOT:PSS/ZnO:Yb/n-Si light-emitting diodes. These results are considered an effective strategy for rare-earth-doped semiconductor electroluminescence in near-infrared light-emitting diodes.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"226 ","pages":"Article 109102"},"PeriodicalIF":1.4,"publicationDate":"2025-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143628006","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Y. Yan , M. Rack , M. Vanbrabant , M. Nabet , A. Goebel , P. Clifton , J.-P. Raskin
{"title":"Traps characterization in RF SOI substrates including a buried SiGe layer","authors":"Y. Yan , M. Rack , M. Vanbrabant , M. Nabet , A. Goebel , P. Clifton , J.-P. Raskin","doi":"10.1016/j.sse.2025.109103","DOIUrl":"10.1016/j.sse.2025.109103","url":null,"abstract":"<div><div>This work analyzes the interface traps density (<em>D</em><sub>it</sub>) at the SiO<sub>2</sub>/SiGe interface of a buried SiGe stressor SOI substrate, and demonstrates the impact of those traps on the effective resistivity (<em>ρ</em><sub>eff</sub>) of the substrate. The <em>C-V</em> behavior of MOS capacitors and the RF insertion loss along coplanar waveguide transmission lines on various substrates are measured. TCAD simulations are employed to interpret the traps characteristics and to forecast the RF performance of a buried SiGe stressor SOI wafer having a high resistivity handle Si substrate. The results demonstrate that thanks to the interface traps introduced by the SiGe layer the substrate effective resistivity (<em>ρ</em><sub>eff</sub>) is enhanced.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"226 ","pages":"Article 109103"},"PeriodicalIF":1.4,"publicationDate":"2025-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143620324","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
N. Aruna Kumari , Abhishek Kumar Upadhyay , Vikas Vijayvargiya , Gaurav Singh , Ankur Beohar , Prithvi P.
{"title":"An efficient temperature dependent compact model for nanosheet FET for neuromorphic computing circuit","authors":"N. Aruna Kumari , Abhishek Kumar Upadhyay , Vikas Vijayvargiya , Gaurav Singh , Ankur Beohar , Prithvi P.","doi":"10.1016/j.sse.2025.109096","DOIUrl":"10.1016/j.sse.2025.109096","url":null,"abstract":"<div><div>In this work, a temperature-dependent compact model is proposed for the three-sheet (3S) Nanosheet (NS) FET. This model is developed because a computationally efficient model is needed for large-scale circuit design. The model is based on the virtual source (VS) principle, which is chosen because for its simple mathematical formulation and minimal parameter requirements. This allows the model to accurately capture the performance characteristics of the 3S NSFET. The model is validated using TCAD results, which are well-calibrated with experimental data. It is then implemented in Verilog-A code for neuromorphic circuit simulations. Herein, we analyses the important parameters such as power, energy, and spiking frequency in NSFET-based leaky integrate-and-fire (LIF) neurons, with temperature variations. The results show that as the temperature increased from 25 °C to 125 °C, the spiking frequency increased by 36.64 %, due to higher current in the subthreshold operation of the device.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"227 ","pages":"Article 109096"},"PeriodicalIF":1.4,"publicationDate":"2025-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143855774","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Fucheng Wang , Mengmeng Chu , Jingwen Chen , Zhong Pan , Yongsang Kim , Jang kun Song , Muhammad Quddamah Khokhar , Junsin Yi
{"title":"Low power consumption of non-volatile memory device by tunneling process engineering","authors":"Fucheng Wang , Mengmeng Chu , Jingwen Chen , Zhong Pan , Yongsang Kim , Jang kun Song , Muhammad Quddamah Khokhar , Junsin Yi","doi":"10.1016/j.sse.2025.109100","DOIUrl":"10.1016/j.sse.2025.109100","url":null,"abstract":"<div><div>Compared with Si<sub>3</sub>N<sub>4</sub> and Al<sub>2</sub>O<sub>3</sub>, SiO<sub>2</sub> grown using thermal oxidation process as tunneling layer has the advantages of high bandgap and well interface contact with the surface of silicon wafer, which can be a great solution to the leakage current problem of metal–insulator-semiconductor (MIS) devices. This study investigates the effect of improving the SiO<sub>2</sub> tunnel layer on the operating voltage of MIS devices with a SiO<sub>2</sub>/HfAlO<sub>x</sub>/Al<sub>2</sub>O<sub>3</sub> structure. The result shows the operating voltage changes as the tunneling layer thickness decreases, with a minimum of only 12 V for a 1.5 nm tunneling layer thickness. In addition, we found that pinholes are generated on the film surface when annealing a 1.5 nm SiO<sub>2</sub> tunnel layer at 850 °C N<sub>2</sub>, in which case the operating voltage of the device is reduced to only 10 V, though it was also accompanied by the deterioration of the retention characteristics.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"226 ","pages":"Article 109100"},"PeriodicalIF":1.4,"publicationDate":"2025-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143627960","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}