{"title":"A general physical model for short-channel double-gate SOI MOSFETS","authors":"Zheming Li, J. Woo","doi":"10.1109/SOI.1997.634945","DOIUrl":"https://doi.org/10.1109/SOI.1997.634945","url":null,"abstract":"Previous works on the modeling of short-channel double-gate devices in the above-threshold regime were based mainly on modifying the current expressions for bulk devices. These models would probably be of limited utility because they do not account for the central physical characteristic of the double-gate devices, namely the coupling of the two channels. In this paper, we present a general physical model which explicitly accounts for physical effects such as channel coupling and drain induced conductance enhancement (DICE). The model is a major extension of the single-gate SOI MOSFET model to the double-gate case.","PeriodicalId":344728,"journal":{"name":"1997 IEEE International SOI Conference Proceedings","volume":"299 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134315878","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A comparative study of SOI inverter circuits for low-voltage and low-power applications","authors":"W. Jin, C. Chan","doi":"10.1109/SOI.1997.634958","DOIUrl":"https://doi.org/10.1109/SOI.1997.634958","url":null,"abstract":"Substantial progress has been made in SOI technology for low-voltage and low-power applications in recent years. Novel SOI devices, with the capabilities of low power and high performance, have been proposed, modeled and fabricated. A comparison of these devices at circuit level is highly required. However, previous works are either incomplete or at device level. In this paper, a comparative study of inverter circuits composed of four types of SOI devices is conducted based on MEDICI simulation.","PeriodicalId":344728,"journal":{"name":"1997 IEEE International SOI Conference Proceedings","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134133874","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
J. Schwank, M. Anc, M. Shaneyfelt, B. Draper, T.L. Meisenheimer, W. L. Warren, K. Vanheusden, D. Fleetwood, L.P. Schanwald
{"title":"Improving ITOX conditions for low defect density and BOX breakdown","authors":"J. Schwank, M. Anc, M. Shaneyfelt, B. Draper, T.L. Meisenheimer, W. L. Warren, K. Vanheusden, D. Fleetwood, L.P. Schanwald","doi":"10.1109/SOI.1997.634909","DOIUrl":"https://doi.org/10.1109/SOI.1997.634909","url":null,"abstract":"A narrow dose-energy process window exists for the formation of high-quality low dose SIMOX layers. Process instabilities require annealing schemes that enlarge the process window to improve manufacturability. As recently shown, the integrity of thin buried oxides has been improved by annealing in a highly oxidizing ambient. In this work, we extend the investigations to the effects of high temperature oxidation on the integrity and radiation hardness of the thin BOX SIMOX implanted with doses from the extreme ends of the process window. In addition, we explore the effects of moderate temperature H/sub 2/ anneals on BOX integrity.","PeriodicalId":344728,"journal":{"name":"1997 IEEE International SOI Conference Proceedings","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131082463","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Design criteria for a fully depleted-0.1 /spl mu/m SOI technology","authors":"J. Burns, R. Frankel, A. Soares, P. Wyatt","doi":"10.1109/SOI.1997.634941","DOIUrl":"https://doi.org/10.1109/SOI.1997.634941","url":null,"abstract":"A sub-0.25 /spl mu/m fully depleted silicon-on-insulator (FDSOI) technology has been developed and fully scaled ring oscillators fabricated using 193-nm lithography. This technology is being extended by incorporating phase shift techniques with 193-nm lithography to fabricate polysilicon gates with 0.1 /spl mu/m drawn channel lengths. The purpose of this paper is to define the process and design requirements for a fully depleted, 0.1 /spl mu/m SOI technology and predict the performance characteristics of 0.1 /spl mu/m ring oscillators.","PeriodicalId":344728,"journal":{"name":"1997 IEEE International SOI Conference Proceedings","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133981382","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
C. Tretz, C. Chuang, L. Terman, C. Anderson, C. Zukowski
{"title":"Metastability of SOI CMOS latches","authors":"C. Tretz, C. Chuang, L. Terman, C. Anderson, C. Zukowski","doi":"10.1109/SOI.1997.634983","DOIUrl":"https://doi.org/10.1109/SOI.1997.634983","url":null,"abstract":"SOI has recently emerged as a serious contender for low-power high-performance applications. This paper examines the metastability of CMOS latches based on partially-depleted (PD) SOI devices with various body-connection topologies.","PeriodicalId":344728,"journal":{"name":"1997 IEEE International SOI Conference Proceedings","volume":"260 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133662003","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
R.A. Johnson, S. Kasa, P. de la Houssaye, G. Garcia, I. Lagnado, P. Asbeck
{"title":"Novel polysilicon sidewall gate silicon-on-sapphire MOSFET for power amplifier applications","authors":"R.A. Johnson, S. Kasa, P. de la Houssaye, G. Garcia, I. Lagnado, P. Asbeck","doi":"10.1109/SOI.1997.634970","DOIUrl":"https://doi.org/10.1109/SOI.1997.634970","url":null,"abstract":"We report the processing and DC and microwave characteristics of a novel thin-film silicon-on-sapphire MOS transistor which utilizes a sidewall process to realize a deep sub-micron gate length without the use of lithography. The device also incorporates an asymmetric lightly doped drain region for high breakdown voltage. Devices with 0.15 and 0.25 /spl mu/m gate lengths have been fabricated. A FET with a 0.25 /spl mu/m gate length and 1.0 /spl mu/m LDD length had an f/sub t/=9 GHz, f/sub max/=27 GHz and breakdown voltage of 13 volts.","PeriodicalId":344728,"journal":{"name":"1997 IEEE International SOI Conference Proceedings","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122319109","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
K. Mashiko, K. Ueda, K. Nii, Y. Wada, T. Hirota, S. Maeda, T. Iwamatsu, Y. Yamaguchi, T. Ipposhi, S. Maegawa, H. Hamano
{"title":"A 0.35 /spl mu/m 560 KG SOI/CMOS gate array using field-shield isolation technique","authors":"K. Mashiko, K. Ueda, K. Nii, Y. Wada, T. Hirota, S. Maeda, T. Iwamatsu, Y. Yamaguchi, T. Ipposhi, S. Maegawa, H. Hamano","doi":"10.1109/SOI.1997.634985","DOIUrl":"https://doi.org/10.1109/SOI.1997.634985","url":null,"abstract":"Summary form only given. SOI/CMOS devices have been developed not only for memory LSIs but also for logic LSIs. Some of the recent works include gate arrays having 220-320 K usable gates and operating at a 2.0 V supply voltage. As the history of bulk/CMOS devices indicate, the market will demand SOI/CMOS gate array to integrate more and more gates and operate at lower and lower supply voltages to reduce power consumption. This paper describes a 1.0 V 560 KG SOI/CMOS gate array using 0.35 /spl mu/m partially-depleted transistors to meet this demand. The field-shield isolation technique stabilizes the body potential of transistors sufficiently to suppress the floating-body problems. Also the technique eliminates the leakage current flowing through the transistor edge to suppress the standby current under sub-threshold leakage-level.","PeriodicalId":344728,"journal":{"name":"1997 IEEE International SOI Conference Proceedings","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123588457","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
W. Maszara, J. Bennett, T. Boden, R. Dockerty, C. Gondran, S. Jackett-Murphy, P. Vasudev, M. Anc, H. Hovel
{"title":"Low dose SIMOX and impact of ITOX process on quality of SOI film","authors":"W. Maszara, J. Bennett, T. Boden, R. Dockerty, C. Gondran, S. Jackett-Murphy, P. Vasudev, M. Anc, H. Hovel","doi":"10.1109/SOI.1997.634911","DOIUrl":"https://doi.org/10.1109/SOI.1997.634911","url":null,"abstract":"Summary form only given. Internal thermal oxidation (ITOX) has been shown to improve the quality of buried oxide (BOX) in low dose (4E17 cm/sup -2/) SOI SIMOX material. SOI film quality of ITOX SIMOX was determined to be as good as bulk in terms of the integrity of gate oxide grown on it. We have investigated low dose SIMOX material and the impact of its high temperature annealing as well as the subsequent ITOX process on structure and electrical properties of its SOI film. Several new findings about the SOI film quality and its relationship to process parameters are reported.","PeriodicalId":344728,"journal":{"name":"1997 IEEE International SOI Conference Proceedings","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130183025","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"SIMOX voltage references for applications up to 275/spl deg/C using the threshold voltage difference principle","authors":"C. Eisenhut, J. W. Klein","doi":"10.1109/SOI.1997.634957","DOIUrl":"https://doi.org/10.1109/SOI.1997.634957","url":null,"abstract":"This paper will present SIMOX voltage reference circuits using the threshold voltage difference principle for applications up to 275/spl deg/C. We have performed measurements concerning temperature-, supply voltage-, load current- and long term-stability.","PeriodicalId":344728,"journal":{"name":"1997 IEEE International SOI Conference Proceedings","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125886382","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Y. Tseng, W.M. Huang, B. Ikegami, D. Diaz, J. Ford, J. Woo
{"title":"Local floating body effect in body-grounded SOI nMOSFETs","authors":"Y. Tseng, W.M. Huang, B. Ikegami, D. Diaz, J. Ford, J. Woo","doi":"10.1109/SOI.1997.634915","DOIUrl":"https://doi.org/10.1109/SOI.1997.634915","url":null,"abstract":"Summary form only given. In this paper, the width dependence of the kink effect and the low frequency noise overshoot in the body grounded H-gate SOI MOSFETs have been studied. These phenomena are related to the local floating body effects resulting from the intrinsic body impedance. Also, it is suggested that the unique low frequency noise overshoot in SOI can be a sensitive tool to evaluate the efficiency of the body contact.","PeriodicalId":344728,"journal":{"name":"1997 IEEE International SOI Conference Proceedings","volume":"83 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121901820","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}