{"title":"Inverse modeling profile determination: implementation issues and recent results","authors":"N. Khalil, J. Faricelli","doi":"10.1109/SISPAD.1996.865254","DOIUrl":"https://doi.org/10.1109/SISPAD.1996.865254","url":null,"abstract":"Since we first reported on the inverse modeling technique to determine oneand two-dimensional doping profiles of a MOSFET, we have had considerable success in using the method. The procedure has become an essential component in our TCAD characterization efforts. In this paper, we first present a recent object-oriented implementation based on the Tcl/Tk toolkit. We then discuss enhancements and adaptations to MINIMOS to make it more suitable as a Poisson solver for capacitance calculation. We also investigate the use of V/sub th/ data instead of inner sidewall capacitance data to determine the 2D channel doping and elaborate on the merits and limitations of this approach. Finally, we show recent results that illustrate the applicability of the method for the characterization of deep submicron technology, and the importance of accurate 2D doping profiles for device simulation.","PeriodicalId":341161,"journal":{"name":"1996 International Conference on Simulation of Semiconductor Processes and Devices. SISPAD '96 (IEEE Cat. No.96TH8095)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127708491","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Advanced geometric techniques in 3D process simulation","authors":"N.A. Golias, R. Dutton","doi":"10.1109/SISPAD.1996.865323","DOIUrl":"https://doi.org/10.1109/SISPAD.1996.865323","url":null,"abstract":"The modeling of semiconductor devices in the deep submicron era is a complicated and challenging procedure. Due to continuous scaling of IC structures many physical effects pose requirements for a full 3D simulation. The incorporation of advanced computational geometry techniques is imperative in the realization of such 3D process simulation tools. The simulation of a virtual factory, with the various processing steps (ion implantation, diffusion, oxidation, etching and deposition) directly modeled on a 3D tetrahedral grid presents many advantages, such as the direct geometry extraction for subsequent interconnect analysis and device simulation. Advanced geometric techniques for the realization of a virtual IC fabrication simulator directly on a 3D tetrahedral grid are presented. A highly efficient algorithm for refining unstructured tetrahedral meshes, having an O(n) computational complexity which generate very high quality elements, is used as the main tool for adaptive mesh generation. Techniques for the automatic grid formation based on the mask layout and processing information and deposition of material layers are also presented.","PeriodicalId":341161,"journal":{"name":"1996 International Conference on Simulation of Semiconductor Processes and Devices. SISPAD '96 (IEEE Cat. No.96TH8095)","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117319218","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A new high-speed non-equilibrium point defect model for annealing simulation","authors":"M. Kawakami, M. Sugaya, S. Kamohara","doi":"10.1109/SISPAD.1996.865288","DOIUrl":"https://doi.org/10.1109/SISPAD.1996.865288","url":null,"abstract":"As state-of-the-art processes involve fast annealing times at reduced temperatures, it has become increasingly important to incorporate non-equilibrium point defect modeling into the simulation of diffusion. Nonequilibrium point defect modeling takes into account the actual distribution of the defects in the silicon when simulating the annealing of impurities. However, simulation time increases dramatically with the number of equations necessary to simulate multiple types of impurities simulated simultaneously (by a factor of n/sup 2/, n=no. of equations). Previous physically-based methods used 1D simulation of one impurity, since 2D simulation of multiple impurities required excessive CPU time making it difficult to use for practical applications. In this work, for the first time, a high-speed physically-based 2D method of simulating the annealing of multiple impurities is presented which requires only a fraction of the CPU time for simulation of several impurities simultaneously.","PeriodicalId":341161,"journal":{"name":"1996 International Conference on Simulation of Semiconductor Processes and Devices. SISPAD '96 (IEEE Cat. No.96TH8095)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115809323","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Optical-electronic simulation of a GaAs metal-semiconductor-metal (MSM) photodetector","authors":"T. Korner, P. D. Yoder, L. Bomholt, W. Fichtner","doi":"10.1109/SISPAD.1996.865267","DOIUrl":"https://doi.org/10.1109/SISPAD.1996.865267","url":null,"abstract":"A complete optical-electronical simulation of a GaAs based MSM photodetector is presented. In the modeling, rigorous electromagnetic methods for the light propagation have been combined with particle-based Monte-Carlo electronic device simulation methods.","PeriodicalId":341161,"journal":{"name":"1996 International Conference on Simulation of Semiconductor Processes and Devices. SISPAD '96 (IEEE Cat. No.96TH8095)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121700203","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A novel transient enhanced diffusion model of phosphorus during shallow junction formation","authors":"H. Sato, K. Aoyama, K. Tsuneno, H. Masuda","doi":"10.1109/SISPAD.1996.865289","DOIUrl":"https://doi.org/10.1109/SISPAD.1996.865289","url":null,"abstract":"High-dose ion implantation and low temperature annealing are one of the key technologies for shallow junction fabrication in quarter-micron CMOS VLSIs. It is well known that transient enhanced diffusion (TED) of implanted dopants dominates in diffusion mechanism at low temperature furnace annealing and RTA (Rapid Thermal Annealing). We reported an empirical compact model of TED which describes its dependency on implant doses and annealing temperature. However, the model assumes effective diffusivity during the 10 minutes in furnace annealing, therefore it fails to describe time-dependent TED effect such as short-time RTA and ramping-effect in furnace annealing. In this work, a new study on transient enhanced diffusion is discussed, which is focused on the RTA process for phosphorus diffusion. The dependency of annealing time on TED phenomenon is newly characterized as parameters of annealing temperature and implant dose in the new model.","PeriodicalId":341161,"journal":{"name":"1996 International Conference on Simulation of Semiconductor Processes and Devices. SISPAD '96 (IEEE Cat. No.96TH8095)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123822791","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Computational performance of level set methods for etching, deposition, and lithography development","authors":"D. Adalsteinsson, J. Sethian","doi":"10.1109/SISPAD.1996.865281","DOIUrl":"https://doi.org/10.1109/SISPAD.1996.865281","url":null,"abstract":"The application of level set techniques to problems of two and three dimensional surface evolution in etching, deposition, and lithography development have been described. The techniques are robust, accurate, unbreakable, and extremely fast, and can be applied to highly complex two and three dimensional surface topography evolutions, including sensitive flux/visibility integration laws, simultaneous etching and deposition, effects of non-convex sputter laws demonstrating faceting, as well as ion-sputtered re-deposition and re-emission with low sticking coefficients, and surface diffusion. In this paper, we will focus on efficient algorithms for some of the most complex problems, and discuss the computational requirements and performance of these techniques.","PeriodicalId":341161,"journal":{"name":"1996 International Conference on Simulation of Semiconductor Processes and Devices. SISPAD '96 (IEEE Cat. No.96TH8095)","volume":"85 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131537106","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Fast step coverage simulation for 3D contact hole with analytical integral","authors":"T. Shinzawa, H. Kato","doi":"10.1109/SISPAD.1996.865282","DOIUrl":"https://doi.org/10.1109/SISPAD.1996.865282","url":null,"abstract":"We have developed a high speed Al CVD profile simulator for ULSI 3D contact filling using analytical integral for gas phase flux and re-emission flux from contact surface. The analytical integral formulation for 3D circular contact is described in detail. The analytical integral simulator has four times faster simulation speed than that using numerical integral. The simulation results agree well with observed experimental results except for the bottom coverage.","PeriodicalId":341161,"journal":{"name":"1996 International Conference on Simulation of Semiconductor Processes and Devices. SISPAD '96 (IEEE Cat. No.96TH8095)","volume":"72 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131335536","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"An implicit coupling scheme for the use of long time steps in stable self-consistent particle simulation of semiconductor devices with high doping levels","authors":"D. Liebig, A. Abou Elnour, K. Schunemann","doi":"10.1109/SISPAD.1996.865266","DOIUrl":"https://doi.org/10.1109/SISPAD.1996.865266","url":null,"abstract":"The aim of the present work is to introduce an efficient iterative implicit coupling scheme for the stochastic particle simulation of semiconductor devices which allows to use long time-steps between successive solutions of the Poisson equation even if the maximum plasma frequency is very high, and which easily can incorporate particle-mesh coupling schemes which guarantee weak self-forces and to first order can also incorporate exact integration of the equations of motion across cell-boundaries of the Poisson-grid. The new method can directly improve the computational efficiency of many particle simulators (standard MC, full-band MC, CA-methods) by an order of magnitude if devices with high free carrier densities are under investigation.","PeriodicalId":341161,"journal":{"name":"1996 International Conference on Simulation of Semiconductor Processes and Devices. SISPAD '96 (IEEE Cat. No.96TH8095)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114945082","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"An interpolation technique for the numerical solution of the rate equations in extended defect simulation","authors":"O. Dokumaci, M. Law","doi":"10.1109/SISPAD.1996.865262","DOIUrl":"https://doi.org/10.1109/SISPAD.1996.865262","url":null,"abstract":"Extended defects play an important role in the diffusion and electrical activation of dopants in silicon. All extended defects have been observed to have a range of sizes. The evolution of the size distribution can be calculated through a series of discrete rate equations. Since the extended defects can contain millions of atoms, the number of rate equations can become so large that it will be impossible to solve all of them. In this paper, we compare three different methods of reducing the number of equations for extended defect simulation: Linear interpolation, exponential interpolation, and linear rediscretization.","PeriodicalId":341161,"journal":{"name":"1996 International Conference on Simulation of Semiconductor Processes and Devices. SISPAD '96 (IEEE Cat. No.96TH8095)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127606847","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Numerical simulations of surface states effects on GaAs power MESFETs","authors":"P. Francis, Y. Ohno, M. Nogome, Y. Takahashi","doi":"10.1109/SISPAD.1996.865302","DOIUrl":"https://doi.org/10.1109/SISPAD.1996.865302","url":null,"abstract":"Summary form only given. The effects of surface states on the gate offset regions of GaAs power MESFETs are analyzed using a two-dimensional device simulator with a Shockley-Read-Hall statistics model for the surface states. Assuming electron trap type surface states and hole trap type surface states, it is found that the trap properties cause a large difference in DC performance and pulse operation of the FETs.","PeriodicalId":341161,"journal":{"name":"1996 International Conference on Simulation of Semiconductor Processes and Devices. SISPAD '96 (IEEE Cat. No.96TH8095)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133591585","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}