An interpolation technique for the numerical solution of the rate equations in extended defect simulation

O. Dokumaci, M. Law
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Abstract

Extended defects play an important role in the diffusion and electrical activation of dopants in silicon. All extended defects have been observed to have a range of sizes. The evolution of the size distribution can be calculated through a series of discrete rate equations. Since the extended defects can contain millions of atoms, the number of rate equations can become so large that it will be impossible to solve all of them. In this paper, we compare three different methods of reducing the number of equations for extended defect simulation: Linear interpolation, exponential interpolation, and linear rediscretization.
扩展缺陷模拟中速率方程数值解的插值技术
扩展缺陷对掺杂剂在硅中的扩散和电活化起着重要的作用。所有扩展缺陷都被观察到有一定的尺寸范围。尺寸分布的演变可以通过一系列离散速率方程来计算。由于扩展缺陷可以包含数以百万计的原子,速率方程的数量可能会变得如此之大,以至于不可能解决所有的问题。在本文中,我们比较了三种不同的方法来减少方程的数量扩展缺陷模拟:线性插值,指数插值和线性再离散化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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