2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits最新文献_第2页

Failure Analysis of I/O with ESD Protection Devices in Advanced CMOS Technologies 先进CMOS技术中带有ESD保护器件的I/O失效分析

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2007-07-11 DOI: 10.1109/IPFA.2007.4378100

M. Muhammad, R. Gauthier, K. Chatty, Junjun Li, C. Seguin

引用次数: 5

The Impact of N-Drift Implant on ESD Robustness of High-Voltage NMOS with Embedded SCR Structure in 40-V CMOS Process n漂移植入对40 v CMOS工艺中嵌入可控硅结构的高压NMOS ESD稳健性的影响

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2007-07-11 DOI: 10.1109/IPFA.2007.4378094

W. Chang, M. Ker, Tai-Xiang Lai, Tien-Hao Tang, K. Su

引用次数: 1

Improving the DC performance of Bulk FinFETs by Optimum Body Doping 用最佳体掺杂改善体finfet的直流性能

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2007-07-11 DOI: 10.1109/IPFA.2007.4378080

C. R. Manoj, M. Nagpal, V. Ramgopal Rao

引用次数: 7

Comparison of Negative Bias Temperature Instability in HfSiO(N)/TaN and SiO(N)/poly-Si pMOSFETs HfSiO(N)/TaN和SiO(N)/多晶硅pmosfet负偏置温度不稳定性的比较

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2007-07-11 DOI: 10.1109/IPFA.2007.4378064

V. Maheta, S. Purawat, G. Gupta

引用次数: 1

Analytic model for the post-breakdown current in HfO2/TaN/TiN gate stacks HfO2/TaN/TiN栅极堆击穿后电流的解析模型

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2007-07-11 DOI: 10.1109/IPFA.2007.4378104

E. Miranda, K. Pey, R. Ranjan, C. Tung

引用次数: 1

A Compact Model Analysis of Layout Variation Impact on Mechanical Stress in Dielectrics 布局变化对电介质机械应力影响的紧凑模型分析

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2007-07-11 DOI: 10.1109/IPFA.2007.4378060

A. Karmarkar, X. Xu, S. Saha, X. Lin, G. Rollins, X. Lin

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引用次数: 0

Failure Analysis on Low Pull Strength of Thermo-sonic Wedge Bond between Gold Wire and Gold Substrate of MEMS Device MEMS器件金线与金衬底热声楔键低拉强度失效分析

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2007-07-11 DOI: 10.1109/IPFA.2007.4378106

S. K. Thakur, Gan Tai Kwee

引用次数: 0

Combine Micro-probing and ORBICH to Catch Non-recognizable Fault in RF and Mixed-Mode Integrated Circuits 结合微探测和ORBICH捕捉射频和混合模式集成电路中的不可识别故障

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2007-07-11 DOI: 10.1109/IPFA.2007.4378087

C. Shen, Liang-Feng Wen, T. Chuang, Y.-L. Chang, Shi-Chen Lin, Chen-May Huang, J.H. Chou

引用次数: 0

IC Debug and Defect Localization using Dynamic Laser Stimulation and Time-Resolved Emission 基于动态激光刺激和时间分辨发射的集成电路调试和缺陷定位

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2007-07-11 DOI: 10.1109/IPFA.2007.4378090

J. Ferrigno, P. Perdu, K. Sanchez, D. Lewis, M. Valletc, S. Dudit

引用次数: 1

The Defects of Silicon Reacted with Carbon Content Vapour in ULSI Nano-meter-Generation Technology 在超细硅纳米级生成技术中，硅的缺陷与含碳蒸汽发生反应

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2007-07-11 DOI: 10.1109/IPFA.2007.4378101

Po-Ying Chen, Shen-Li Chen, M. Tsai, M.H. Jing, T. Lin, Cheng-Chia Kuo

引用次数: 0