Improving the DC performance of Bulk FinFETs by Optimum Body Doping

C. R. Manoj, M. Nagpal, V. Ramgopal Rao
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引用次数: 7

Abstract

It is shown that body doping can be used to match the Bulk FinFETs' DC performance with that of SOI FinFETs, even down to 22 nm technology node, by using calibrated full 3D device simulations. However higher body doping does not necessarily mean better performance always as there is a optimum body doping. The optimum doping should be carefully chosen such that device exhibits no punch through and no BTBT leakage currents. Thus careful body doping optimization is critical for the reliable device operation of novel Bulk FinFET structures.
用最佳体掺杂改善体finfet的直流性能
通过校准的全3D器件模拟,表明体掺杂可以使Bulk finfet的直流性能与SOI finfet的直流性能相匹配,甚至可以降低到22 nm技术节点。然而,更高的身体兴奋剂并不一定意味着更好的表现,因为总是有一个最佳的身体兴奋剂。应仔细选择最佳掺杂,使器件无穿孔和无bt泄漏电流。因此,仔细的体掺杂优化对于新型体FinFET结构的可靠器件运行至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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