结合微探测和ORBICH捕捉射频和混合模式集成电路中的不可识别故障

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2007-07-11 DOI:10.1109/IPFA.2007.4378087

C. Shen, Liang-Feng Wen, T. Chuang, Y.-L. Chang, Shi-Chen Lin, Chen-May Huang, J.H. Chou

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引用次数: 0

摘要

本文提出了一种克服上述困难的新方法，并通过两个实例说明了其应用。在我们的方法中，不需要任何新的仪器，只需要通过这些已经完成的EFA/PFA设备。开发这些想法的关键考虑因素是由于保持这些传统工具的可测试性和有效性，以关注铸造厂可用产品的能力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Combine Micro-probing and ORBICH to Catch Non-recognizable Fault in RF and Mixed-Mode Integrated Circuits

Fhis paper is to present a novel methodology to overcome above hardness, and two case study are brought out to demonstrate the application. In our methodology, no any new instrument was needed but only through these already accomplished EFA/PFA equipments. The key consideration to develop such ideas were due to keeping testability and effectiveness in these conventional tools for focusing on the capabilities of a foundry's available production.

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2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits

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