Failure Analysis on Low Pull Strength of Thermo-sonic Wedge Bond between Gold Wire and Gold Substrate of MEMS Device

Abstract

The damaged wire on the wedge resulted in physically thinning of the wire and caused low pull of second bond between gold wire and gold substrate of MEMS component. The thinned wire due to lower cross-section was unable to take high pull force and hence showed poor load sharing with the substrate and hence failed with low pull strength.