MEMS器件金线与金衬底热声楔键低拉强度失效分析

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2007-07-11 DOI:10.1109/IPFA.2007.4378106

S. K. Thakur, Gan Tai Kwee

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引用次数: 0

摘要

楔子上的金属丝损坏导致金属丝物理变薄，导致金属丝与MEMS元件的金衬底之间的第二键拉力低。由于较低的横截面，细线无法承受较高的拉力，因此与基板的负载分担较差，因此在低拉力强度下失败。

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Failure Analysis on Low Pull Strength of Thermo-sonic Wedge Bond between Gold Wire and Gold Substrate of MEMS Device

The damaged wire on the wedge resulted in physically thinning of the wire and caused low pull of second bond between gold wire and gold substrate of MEMS component. The thinned wire due to lower cross-section was unable to take high pull force and hence showed poor load sharing with the substrate and hence failed with low pull strength.

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2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits

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