{"title":"A multi-stage neural network I-V and C-V BSIM-CMG model global parameter extractor for advanced GAAFET technologies","authors":"Jen-Hao Chen , Fredo Chavez , Chien-Ting Tung , Sourabh Khandelwal , Chenming Hu","doi":"10.1016/j.sse.2025.109081","DOIUrl":"10.1016/j.sse.2025.109081","url":null,"abstract":"<div><div>A I-V and C-V parameter extraction methodology with various gate lengths utilizing a multi-stage neural network is proposed. This multi-stage neural network contains four networks focusing on extracting parameters from four different regions in transistor’s characteristics, enabling a machine to emulate human’s parameter extraction strategy. This methodology begins with the generation of a training dataset through Monte Carlo simulation, varying 53 selected IV and CV BSIM-CMG model parameters. With each Monte Carlo-selected parameter set, the I-V, transconductance, output conductance and C-V characteristics of seven different GAAFETs with different gate lengths ranging from 9 nm to 389 nm are generated. This multi-stage neural network is trained with the GAAFETs’ characteristics as the input and the 53 model parameters as the output. After training, TCAD-generated GAAFET I-V, conductance and C-V data with various gate lengths are used to test this neural network parameter extractor’s ability of extracting BSIM-CMG model parameters that generate data accurately fitting the TCAD IV and CV data. It is demonstrated that this parameter extraction neural network can extract BSIM-CMG model parameters’ value for GAAFETs within few seconds.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"226 ","pages":"Article 109081"},"PeriodicalIF":1.4,"publicationDate":"2025-02-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143422482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A. Ortiz-Conde , V.C.P. Silva , P.G.D. Agopian , J.A. Martino , F.J. García-Sánchez
{"title":"Some considerations about Lambert W function-based nanoscale MOSFET charge control modeling","authors":"A. Ortiz-Conde , V.C.P. Silva , P.G.D. Agopian , J.A. Martino , F.J. García-Sánchez","doi":"10.1016/j.sse.2025.109080","DOIUrl":"10.1016/j.sse.2025.109080","url":null,"abstract":"<div><div>The unwanted low-level doping present in supposedly undoped MOSFET channels has a significant effect on charge control and Lambert W function-based inversion charge MOSFET models, as well as on subsequent drain current models. We show that the hypothetical intrinsic MOSFET channel approximation, often used to describe a nominally undoped channel, produces significant errors, even for the low-level concentrations resulting from unintentional doping. We show that the traditional charge control model, which mathematically describes the gate voltage as the sum of one linear and one logarithmic term of the inversion charge, is only valid for the hypothetically intrinsic case. However, it may still be used for nominally undoped but unintentionally low-doped channel devices within the region of operation where the majority carriers are the dominant charge. With this in mind, we present here a better approximation of the nominally undoped MOSFET channel surface potential. We also propose an improved modified expression that describes the gate voltage as the sum of one linear and two logarithmic terms of the inversion charge. A new approximate drain current control formulation is also proposed to account for parasitic series resistance and/or mobility degradation. The new model agrees reasonably well with measurement data from nominally undoped vertically stacked GAA Si Nano Sheet MOSFETs.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"225 ","pages":"Article 109080"},"PeriodicalIF":1.4,"publicationDate":"2025-02-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143377726","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Antonio Cerdeira , Magali Estrada , Ahmed Mounir , Tibor Grasser , Benjamín Iñiguez
{"title":"Analysis of the mobility behavior of MOS2 2D FETs","authors":"Antonio Cerdeira , Magali Estrada , Ahmed Mounir , Tibor Grasser , Benjamín Iñiguez","doi":"10.1016/j.sse.2024.109032","DOIUrl":"10.1016/j.sse.2024.109032","url":null,"abstract":"<div><div>In this work we analyze the behavior of 2D FETs, with channel length greater than the mean free path, and using MOCVD or CVD deposition method for the deposition of the 2D semiconductor layer, with different dielectric materials and EOTs. We show that transfer, output and conductance characteristics can be modeled with precision, considering the hopping transport mechanism as the predominant one, similarly to amorphous or polycrystalline TFTs. It was also observed that for the devices with channel length above one micrometer, mobility increased with the gate voltage as a power law. For channel lengths of 1 µm and 100 nm, mobility decreased with voltage, which in this case, can be attributed to other extrinsic effects, as the presence of high series resistance at the drain and source, which becomes more important as the channel length reduces, modifying its behavior with gate voltage.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"224 ","pages":"Article 109032"},"PeriodicalIF":1.4,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143147216","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Zhizhao Ma , Hao Su , Yuhuan Lin , Shenghua Zhou , Feichi Zhou , Xiaoguang Liu , Longyang Lin , Yida Li , Kai Chen
{"title":"Comprehensive analysis of MOSFET threshold voltage extraction method considering DIBL effect from 300 K down to 10 K","authors":"Zhizhao Ma , Hao Su , Yuhuan Lin , Shenghua Zhou , Feichi Zhou , Xiaoguang Liu , Longyang Lin , Yida Li , Kai Chen","doi":"10.1016/j.sse.2024.109045","DOIUrl":"10.1016/j.sse.2024.109045","url":null,"abstract":"<div><div>It is well known that different threshold voltage <em>(V<sub>th</sub>)</em> extraction methods exhibit inconsistencies with respect to different drain voltage (<em>V<sub>d</sub></em>). This inconsistency becomes disruptive when temperature is considered for cryogenic applications such as quantum computing. This investigation examines various <em>V<sub>th</sub></em> extraction methods from room down to cryogenic temperatures, with a particular emphasis on how different <em>V<sub>d</sub></em> values combined with extraction methods behave as temperature decreases. For the first time, we find that the square root <em>I<sub>d</sub></em> method maintains consistency regardless of <em>V<sub>d</sub></em>, from 300 K all the way down to 10 K is identified. This provides a good insight into how the Drain-Induced Barrier Lowering (DIBL) effect changes with temperature, and positions the square root <em>I<sub>d</sub></em> method as a reliable tool for <em>V<sub>th</sub></em> extraction in cryogenic temperature.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"224 ","pages":"Article 109045"},"PeriodicalIF":1.4,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143147215","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Eui Joong Shin, Jaejoong Jeong, Gyusoup Lee, Seongho Kim, Byung Jin Cho
{"title":"Suppression of de-trapping by remanent polarization in dual-mechanism flash memory","authors":"Eui Joong Shin, Jaejoong Jeong, Gyusoup Lee, Seongho Kim, Byung Jin Cho","doi":"10.1016/j.sse.2024.109049","DOIUrl":"10.1016/j.sse.2024.109049","url":null,"abstract":"<div><div>Recently, a dual-mechanism Flash memory cell that utilizes both charge trapping and polarization switching as the memory mechanism was proposed <span><span>[1]</span></span>. In this work, the data retention characteristics of the dual-mechanism memory are extensively studied. Lifetime and activation energy analyses show that the remanent polarization in the blocking layer of the dual-mechanism memory suppresses the de-trapping of electrons in the charge trap layer. A quantitative analysis of the trapped charge and remanent polarization revealed that the electrons can be stored in a potential well created by the remanent polarization, which effectively improves the retention characteristics.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"224 ","pages":"Article 109049"},"PeriodicalIF":1.4,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143146753","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Simulation and experimental Demonstration on A retrograde drift LDMOS","authors":"Shaoxin Yu , Rongsheng Chen , Weiheng Shao , Xiaoyan Zhao , Zheng Chen , Weizhong Shan , Jenhao Cheng","doi":"10.1016/j.sse.2024.109050","DOIUrl":"10.1016/j.sse.2024.109050","url":null,"abstract":"<div><div>In this article, an RD (Retrograde drift) LDMOS (Lateral double diffused metal oxide semiconductor) device is introduced. The drift region in this proposed device is trapezoidal in shape and gradually decreases from top to bottom in doping concentration, called “retrograde drift.” Simulations indicate that this RD device has an 11.7% lower electric field peak value, 6.2% lower potential under the poly gate, 32.1% higher current width in the drift region, and 10.5% lower impact gen rate at the corner of FP (Field plate) as well. A series of devices have been fabricated using a photoresist treatment process. Compared with the conventional BD (box-shape drift) device, the RD device’s <span><math><mrow><mi>BV</mi></mrow></math></span>(Breakdown voltage)-<span><math><msub><mi>R</mi><mrow><mi>on</mi><mo>,</mo><mi>s</mi><mi>p</mi></mrow></msub></math></span> (on-resistance) FOM (Figure of merit) performance is improved by 30.9%, and the <span><math><msub><mi>Q</mi><mrow><mi>gd</mi></mrow></msub></math></span>(Gate-drain charge)-<span><math><msub><mi>R</mi><mrow><mi>on</mi><mo>,</mo><mi>s</mi><mi>p</mi></mrow></msub></math></span> FOM character is improved by 42.1%. Moreover, the RD device owns better HCI (Hot carrier injection) performance on both <span><math><msub><mi>R</mi><mrow><mi>on</mi><mo>,</mo><mi>s</mi><mi>p</mi></mrow></msub></math></span> degradation and <span><math><msub><mi>V</mi><mi>T</mi></msub></math></span> (Threshold voltage) degradation.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"224 ","pages":"Article 109050"},"PeriodicalIF":1.4,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143147212","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Bo Liu , Yong-Bo Su , Ren-Jie Liu , Zhi Jin , Chao Zhang , Ying-Hui Zhong
{"title":"Equivalence of proton-induced displacement damage in InP-based HEMT","authors":"Bo Liu , Yong-Bo Su , Ren-Jie Liu , Zhi Jin , Chao Zhang , Ying-Hui Zhong","doi":"10.1016/j.sse.2024.109048","DOIUrl":"10.1016/j.sse.2024.109048","url":null,"abstract":"<div><div>Radiation experiments of 560 keV, 2 MeV, and 10 MeV proton have been performed on InP-based High Electron Mobility Transistors (HEMTs), the damage mechanisms and damage equivalence are systematically studied. The irradiated devices have exhibited the reduction of transconductance, the positive shift of threshold voltage, and the reduction in drain-source current. Nonionizing energy loss (NIEL) was calculated to investigate the relationship between the degradation of the device and proton energy, but the damage factors of the devices do not exhibit a perfect linear relationship with NIEL across all the energies. The deviation mainly lies in the stopping power of the target material for incident protons. An improved NIEL calculation method is proposed based on Geant4 simulation software, which eliminates the influence of stopping power. And thus, the equivalence of displacement damage in InP-based HEMTs has been constructed among 560 keV, 2 MeV, and 10 MeV proton irradiation.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"224 ","pages":"Article 109048"},"PeriodicalIF":1.4,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143146759","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Guangxin Guo, Zhengguang Tang, Zhenhai Cui, Cong Li, Hailong You
{"title":"GatedNN: An accurate deep learning-based parameter extraction for BSIM-CMG","authors":"Guangxin Guo, Zhengguang Tang, Zhenhai Cui, Cong Li, Hailong You","doi":"10.1016/j.sse.2024.109044","DOIUrl":"10.1016/j.sse.2024.109044","url":null,"abstract":"<div><div>An enhanced deep learning (DL) -based parameter extraction method for transistor compact models, named GatedNN, is introduced. GatedNN achieves significant accuracy improvements over existing DL-based parameter extraction techniques. The innovation lies in incorporating neural network (NN) with gating mechanism and compact model-aware techniques: model parameter importance analysis and model quality check. The GatedNN uses gates to resolve optimization conflicts among model parameters by controlling gradient descent during training. The importance analysis focuses on optimizing more crucial parameters that contribute to the current curve. The model quality check cleans the training data fed to the GatedNN and ensures the robustness of the NN output. Evaluated on the BSIM-CMG model with measured FinFET data, the proposed approach demonstrates a substantial 69% error reduction compared to recently DL-based parameter extractor. Furthermore, the scalability and mathematical robustness of the generated model are tested. The proposed GatedNN also provides insights into model parameters and device characteristics, aiding in understanding and adjusting for desired characteristics. We believe the developed method can advance the development of DL-based parameter extraction.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"224 ","pages":"Article 109044"},"PeriodicalIF":1.4,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143147214","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Enhanced threshold voltage tuning in FD-SOI MOSFET with ferroelectric buried oxide","authors":"Sorin Cristoloveanu , Etienne Nowak , Justine Barbot , Laurent Grenouillet , Ionut Radu","doi":"10.1016/j.sse.2024.109052","DOIUrl":"10.1016/j.sse.2024.109052","url":null,"abstract":"<div><div>A ferroelectric buried oxide is demonstrated to considerably enhance the tunability of the threshold voltage in FD-SOI transistors. The polarization mechanism makes the rate of change of threshold voltage with back-gate voltage increase tremendously from 4–5 % to more than 50 %. Our model and simulations show that with 1 V applied on the ground-plane, the threshold voltage is shifted by half a volt, which dramatically improves power consumption and speed.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"224 ","pages":"Article 109052"},"PeriodicalIF":1.4,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143147209","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}