Solid-state ElectronicsPub Date : 2025-12-01Epub Date: 2025-10-01DOI: 10.1016/j.sse.2025.109259
N. Paul , S. Chattopadhyay
{"title":"Design and modeling of resonant tunneling transport-controlled voltage-induced double quantum dot channel nanowire field-effect-transistor (DQD-FET) for multi-threshold current levels","authors":"N. Paul , S. Chattopadhyay","doi":"10.1016/j.sse.2025.109259","DOIUrl":"10.1016/j.sse.2025.109259","url":null,"abstract":"<div><div>The article deals with the modeling of gate voltage controlled resonant tunneling transport in a complementary-metal–oxide–semiconductor (CMOS) compatible double quantum dot channel nanowire field-effect-transistor (FET). Appropriate applied voltages at two separate gates, gate-1 and gate-2 of the device form two voltage-tunable quantum dots underneath the gates, within the nanowire channel. The quantum dot eigenstates are tuned by varying the applied gate voltages to enable voltage-modulated resonant tunneling transport. Such transport is modeled by employing a Schrödinger-Poisson self-consistent framework using non-equilibrium Green’s function (NEGF) formalism. Electron–phonon scattering within the nanowire channel is also considered. The transfer characteristics exhibit multiple current thresholds in the range of 10<sup>−4</sup> μA/μm–1 μA/μm due to resonant tunneling. The phonon scattering is observed to significantly depend on nanowire geometry and applied gate voltages, with tunneling dominated quasi-ballistic transport occurring at higher gate voltages. Also, steep sub-threshold slopes of 30 mV/decade–8 mV/decade range and transconductance in the range of 10<sup>−7</sup> μS/μm–1 μS/μm at room temperature are obtained by varying the nanowire diameter in the range of 20 nm–5 nm. Therefore, such device architecture exhibits significant potential for achieving multi-current thresholds in a CMOS compatible architecture at room temperature.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"230 ","pages":"Article 109259"},"PeriodicalIF":1.4,"publicationDate":"2025-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145220576","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Solid-state ElectronicsPub Date : 2025-12-01Epub Date: 2025-08-22DOI: 10.1016/j.sse.2025.109220
Rezwana Sultana , Karimul Islam , Piotr Jeżak , Robert Mroczyński
{"title":"Frequency-driven dielectric analysis of ultrathin HfOx-TiOx composite films","authors":"Rezwana Sultana , Karimul Islam , Piotr Jeżak , Robert Mroczyński","doi":"10.1016/j.sse.2025.109220","DOIUrl":"10.1016/j.sse.2025.109220","url":null,"abstract":"<div><div>This study investigates the frequency-dependent dielectric properties of ultrathin HfO<sub>x</sub>-TiO<sub>x</sub> composite films (HTO) in a metal–oxide–semiconductor (MOS) configuration over a frequency range of 1 kHz to 3 MHz. The films were deposited using a pulsed-DC magnetron sputtering technique in an atomic layer deposition-like manner, incorporating very thin TiO<sub>x</sub> layers within the bulk of HfO<sub>x</sub>. Structural analysis revealed that the films are amorphous and exhibit uniform and smooth surfaces. The dielectric constant (<em>ε</em>′) and dielectric loss (<em>ε</em>′′) exhibit a decreasing trend with increasing frequency, demonstrating typical dielectric behavior. Furthermore, the characteristic dielectric relaxation frequency shifts toward lower frequency values with the insertion of TiO<sub>x</sub>. The Cole-Cole plot confirms the non-Debye relaxation behavior across all samples. Optical spectroscopy analysis reveals a systematic increase in the optical band gap upon more TiO<sub>x</sub> insertion. Analysis of current–voltage (I-V) characteristics demonstrates low leakage currents across the composite films. Understanding the dielectric parameters and the electrical characteristics is crucial for the potential application of these films in advanced electronic applications.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"230 ","pages":"Article 109220"},"PeriodicalIF":1.4,"publicationDate":"2025-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144908456","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Solid-state ElectronicsPub Date : 2025-12-01Epub Date: 2025-10-02DOI: 10.1016/j.sse.2025.109260
Jui-Sheng Wu , Chen-Hsi Tsai , You-Chen Weng , Edward Yi Chang
{"title":"Enhancing ultra-thin-barrier AlGaN/GaN HEMTs with LPCVD SiN passivation for high-power applications","authors":"Jui-Sheng Wu , Chen-Hsi Tsai , You-Chen Weng , Edward Yi Chang","doi":"10.1016/j.sse.2025.109260","DOIUrl":"10.1016/j.sse.2025.109260","url":null,"abstract":"<div><div>Ultra-thin-barrier AlGaN/GaN HEMTs offer a gate-recess-free solution but suffer from high on-resistance and current degradation. In this work, ultra-thin-barrier AlGaN/GaN heterostructures with a 1-nm GaN cap and 5-nm Al<sub>0.22</sub>Ga<sub>0.78</sub>N barrier were fabricated, followed by LPCVD SiN passivation of four different thicknesses (50, 60, 150, and 220 nm) to solve the low carrier density issues associated with thin-barrier structures. The 220 nm LPCVD-SiN passivated device achieves a high <em>I</em><sub>D,max</sub> of 907 mA/mm and the lowest on-resistance of 8.9 Ω·mm. In addition, to evaluate the stability of current output, thinner LPCVD-SiN layers exhibit better current stability under ON-state stress up to 150 °C. These findings highlight the benefits of ultra-thin-barrier AlGaN/GaN HEMTs design for future high-power GaN applications.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"230 ","pages":"Article 109260"},"PeriodicalIF":1.4,"publicationDate":"2025-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145220577","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Solid-state ElectronicsPub Date : 2025-12-01Epub Date: 2025-09-18DOI: 10.1016/j.sse.2025.109250
Run-Song Dou , Jia-Min Li , Fan-Yu Liu , Hui-ping Zhu , Bo Li , Jiang-Jiang Li , Bao-Gang Sun , Yang Huang , Jing Wan , Yong Xu , Zheng-sheng Han , Sorin Cristoloveanu
{"title":"Comparison of Self-Heating effect between SOI and SOS MOSFETs","authors":"Run-Song Dou , Jia-Min Li , Fan-Yu Liu , Hui-ping Zhu , Bo Li , Jiang-Jiang Li , Bao-Gang Sun , Yang Huang , Jing Wan , Yong Xu , Zheng-sheng Han , Sorin Cristoloveanu","doi":"10.1016/j.sse.2025.109250","DOIUrl":"10.1016/j.sse.2025.109250","url":null,"abstract":"<div><div>In this research, we perform an in-depth analysis of the self-heating effect (SHE) and heat transfer characteristics of devices fabricated on silicon-on-insulator (SOI) and silicon-on-silicon carbide (SOS) substrates using technology computer-aided design (TCAD) numerical simulations. The results reveal that, under identical operating conditions, the maximum lattice temperature increase in SOI devices is approximately 3.9 times higher than that in SOS devices, highlighting the superior thermal management properties of SOS devices. When SHE is considered at a gate voltage of 1.8 V, the leakage current in SOS devices decreases by about 27 % compared to SOI devices, demonstrating enhanced resistance to SHE in SOS devices. Analysis of the thermal dissipation pathways reveals that for SOI devices, heat primarily dissipates through the source and drain regions within the device layer, while for SOS devices it predominantly dissipates through the silicon carbide substrate due to its high thermal conductivity, thereby significantly improving thermal dissipation efficiency. Additionally, our research uncovers a correlation between increasing device layer thickness and elevated lattice temperature for both SOI and SOS structures. This phenomenon is closely associated with thermal-electric coupling effects and changes in device thermal resistance.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"230 ","pages":"Article 109250"},"PeriodicalIF":1.4,"publicationDate":"2025-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145096281","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Solid-state ElectronicsPub Date : 2025-12-01Epub Date: 2025-08-23DOI: 10.1016/j.sse.2025.109217
Fernando Pizzo Ribeiro, Egon H.S. Galembeck, Salvador Pinillos Gimenez
{"title":"Boosting the electrical performance of solar cells by using PIN diode structure with different layout styles controlled by MOS capacitor","authors":"Fernando Pizzo Ribeiro, Egon H.S. Galembeck, Salvador Pinillos Gimenez","doi":"10.1016/j.sse.2025.109217","DOIUrl":"10.1016/j.sse.2025.109217","url":null,"abstract":"<div><div>In this study, an innovative solar cell (SC) design is proposed and analyzed using the Sentaurus Technology Computer-Aided Design (TCAD) simulator. Departing from conventional rectangular architecture, a half-circular geometry is introduced to improve light absorption and enhance electrical performance. The simulation framework models the solar cell’s behavior under standard test conditions, incorporating realistic material properties and stratified layer structures. Key electrical performance metrics, Fill Factor (FF), and conversion Efficiency are evaluated. The results demonstrate that the half-circular configuration achieves an energy conversion efficiency of 15.33 %, and an FF of 74.2 %. This work lays the groundwork for future experimental validation and encourages the investigation of alternative geometries to improve photovoltaic device performance further.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"230 ","pages":"Article 109217"},"PeriodicalIF":1.4,"publicationDate":"2025-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144988850","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Solid-state ElectronicsPub Date : 2025-12-01Epub Date: 2025-09-16DOI: 10.1016/j.sse.2025.109249
Nargis Khatun , Sumona Sinha , A.K.M. Maidul Islam
{"title":"ZnPc-based schottky diodes: Effect of amorphous polymer interlayers on electrical and structural properties","authors":"Nargis Khatun , Sumona Sinha , A.K.M. Maidul Islam","doi":"10.1016/j.sse.2025.109249","DOIUrl":"10.1016/j.sse.2025.109249","url":null,"abstract":"<div><div>This study investigates the influence of Indium Tin Oxide (ITO) electrode surface modification on the electrical properties of zinc phthalocyanine (ZnPc)– based Schottky diodes, using amorphous polymers, specifically polystyrene (Ps) and poly(butyl methacrylate) (PBMA). Devices with configurations of Al (Aluminum)/ZnPc/ITO, Al/ZnPc/Ps/ITO, and Al/ZnPc/PBMA/ITO were fabricated and analysed through current–voltage (I-V) characterisation. Devices modified with polymers showed significantly improved electrical performance, with the rectification ratio rising from 0.81 (pure ZnPc) to 4.24 for ITO modified with PBMA and 6.32 for ITO modified with Ps, along with optimised ideality factors and reduced series resistance. Space-charge-limited conduction (SCLC) became dominant, indicating enhanced charge mobility in the modified devices. UV–Vis analysis further confirmed this improvement, showing that PBMA modification enhances π–π* interactions and molecular aggregation within ZnPc thin films, reducing the optical bandgap from 3.05 eV to 2.75 eV (Ps) and 2.68 eV (PBMA), which indicates modified electronic properties due to polymer incorporation. Structural investigations employing XRR and AFM complement these findings, demonstrating improved crystallite size and a smoother surface, which lead to better charge transport. These results highlight the efficiency of polymer surface modification in enhancing ZnPc-based Schottky diodes, presenting intriguing possibilities for future optoelectronic applications.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"230 ","pages":"Article 109249"},"PeriodicalIF":1.4,"publicationDate":"2025-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145109137","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Trap-rich high-resistivity silicon for improved on-chip monolithic transformers characteristics","authors":"Najeh Zeidi , Farès Tounsi , Jean-Pierre Raskin , Denis Flandre","doi":"10.1016/j.sse.2025.109261","DOIUrl":"10.1016/j.sse.2025.109261","url":null,"abstract":"<div><div>This paper investigates the performance of monolithic on-chip planar transformers implemented on high-resistivity substrates incorporating a trap-rich layer (HR-Si + TR), using both experimental measurements and electromagnetic simulations. Two transformer topologies, i.e., interleaved and concentric, were fabricated, measured, and simulated on both standard silicon (Std-Si) and HR-Si + TR to assess the impact of substrate losses. Key figures of merit, including self-resonant frequency (SRF), mutual inductance, reactive and resistive coupling factors, and maximum power-transfer efficiency, were extracted and compared. Results show that the HR-Si + TR substrate markedly enhances both topologies: for the interleaved transformer, the SRF increases by 3.8 % from 3.66 to 3.80 GHz, while the peak power-transfer efficiency nearly doubles from 0.33 at 1.42 GHz to 0.63 at 2.26 GHz; for the concentric transformer, the SRF rises by over 31 % from 3.12 to 4.10 GHz, and the efficiency increases more than threefold from 0.06 at 1.48 GHz to 0.22 at 2.15 GHz. These improvements arise from the HR-Si + TR substrate’s ability to substantially reduce the resistive mutual coupling factor by minimizing eddy current losses in the substrate and raising the impedance of the RC leakage path to ground, thereby limiting trace crosstalk and power leakage between traces. The benefits are particularly pronounced in the concentric topology, where the larger winding separation amplifies the impact of reduced substrate-induced losses.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"230 ","pages":"Article 109261"},"PeriodicalIF":1.4,"publicationDate":"2025-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145266540","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"CMOS back-end-of-line integration of bilayer ferroelectric tunnel junction in 1-transistor-1-capacitor circuit","authors":"Keerthana Shajil Nair , Muhammad Hamid Raza , Catherine Dubourdieu , Veeresh Deshpande","doi":"10.1016/j.sse.2025.109255","DOIUrl":"10.1016/j.sse.2025.109255","url":null,"abstract":"<div><div>Ferroelectric tunnel junction (FTJ) devices based on ferroelectric Hf<sub>0.5</sub>Zr<sub>0.5</sub>O<sub>2</sub> (HZO) have recently gained significant interest as CMOS back-end-of-line integrable low power non-volatile memories for neuromorphic computing applications. In this paper, we demonstrate integration of metal-ferroelectric-dielectric-metal bilayer FTJ devices in the back-end-of-line of a 180 nm CMOS technology chip. We present electrical characteristics of the integrated FTJ devices, including the polarization switching and resistance switching behavior with an ON/OFF current ratio of ∼ 18, and an ON current density of ∼ 24.5 μA/cm<sup>2</sup> at a read voltage of 1.8 V. Furthermore, we also demonstrate a 1-transistor-1-capacitor (1T1C) circuit by connecting a back-end FTJ device with a front-end nMOS transistor, which amplifies the ON current of the FTJ device by 2.6 times. Thus, we show the basic building block for the integration of HZO-based FTJ devices for neuromorphic applications.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"230 ","pages":"Article 109255"},"PeriodicalIF":1.4,"publicationDate":"2025-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145266541","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Solid-state ElectronicsPub Date : 2025-12-01Epub Date: 2025-08-29DOI: 10.1016/j.sse.2025.109228
R. Goyal, A. Crespo-Yepes, M. Porti, R. Rodriguez, M. Nafria
{"title":"On the role of power dissipation in the Post-BD behavior of FDSOI NanoWire FETs","authors":"R. Goyal, A. Crespo-Yepes, M. Porti, R. Rodriguez, M. Nafria","doi":"10.1016/j.sse.2025.109228","DOIUrl":"10.1016/j.sse.2025.109228","url":null,"abstract":"<div><div>Dielectric Breakdown, which has been associated with the progressive wear-out of the gate dielectric, has been one of the most detrimental failure mechanisms in CMOS devices. With downscaling, new device architectures and/or materials have been introduced, so, it is necessary to evaluate the BD impact at device (and circuit) level in these new structures. In this work, the dielectric BD and the post-BD behavior in largely scaled FDSOI nanowire transistors with high-k gate dielectric have been characterized, using the energy and the power dissipated by the device under test as key parameters. The experimental results evidence the presence of new detrimental effects for the device’s integrity beyond the traditional dielectric BD.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"230 ","pages":"Article 109228"},"PeriodicalIF":1.4,"publicationDate":"2025-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144933522","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Solid-state ElectronicsPub Date : 2025-12-01Epub Date: 2025-08-23DOI: 10.1016/j.sse.2025.109221
Andreas Fuchsberger , Lukas Wind , Aníbal Pacheco-Sanchez , Johannes Aberl , Moritz Brehm , Lilian Vogl , Peter Schweizer , Masiar Sistani , Walter M. Weber
{"title":"A Schottky barrier field-effect transistor platform with variable Ge content on SOI","authors":"Andreas Fuchsberger , Lukas Wind , Aníbal Pacheco-Sanchez , Johannes Aberl , Moritz Brehm , Lilian Vogl , Peter Schweizer , Masiar Sistani , Walter M. Weber","doi":"10.1016/j.sse.2025.109221","DOIUrl":"10.1016/j.sse.2025.109221","url":null,"abstract":"<div><div>Advancing SOI-based transistors with Ge-rich layers aims to increase device performance in terms of on-state operation and switching speed. Here, we investigate multi-heterojunction SiGe-based Schottky barrier FETs with Ge concentrations up to 75% by means of temperature- dependent electrical characterizations to identify the transport regimes and the effective barrier heights with a thermionic-emission-based model. Importantly, incorporating 33% Ge gives the best compromise for n- and p-type on-state symmetry. As the Ge concentration increases, the p-type on-state current becomes dominant, which is interesting for low-power p-type transistors.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"230 ","pages":"Article 109221"},"PeriodicalIF":1.4,"publicationDate":"2025-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144908455","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}