2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)最新文献_第5页

Current carry capacity characterization for high performance system on chip packages 芯片封装上高性能系统的电流承载能力表征

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Pub Date : 2015-12-01 DOI: 10.1109/EPTC.2015.7412285

N. Ying, Wong Wui Weng

引用次数: 0

Dynamic simulation of die pickup from wafer tape by a multi-disc ejector using peel-energy to peel-velocity coupling 基于剥离能量-剥离速度耦合的多圆盘抛射器从晶圆带上取模的动态模拟

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Pub Date : 2015-12-01 DOI: 10.1109/EPTC.2015.7412268

S. Behler

引用次数: 5

Development of compliant Cu pillar for flip chip package 倒装封装用柔性铜柱的研制

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Pub Date : 2015-12-01 DOI: 10.1109/EPTC.2015.7412352

B. Jung, F. Che, Jong-Kai Lin

引用次数: 3

A methodology for package to test interaction study 一种包测试交互研究方法

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Pub Date : 2015-12-01 DOI: 10.1109/EPTC.2015.7412267

Han Guan Tan, L.P. Ng, Jie Huang, A. Yeo

引用次数: 0

Microball and thicker Cu Pad: A substrate solution for better package reliability and robustness on bumped devices 微球和更厚的铜衬垫:在碰撞器件上提供更好的封装可靠性和稳健性的衬底解决方案

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Pub Date : 2015-12-01 DOI: 10.1109/EPTC.2015.7412341

Jayson Rae Tulas, Tony Taloban

{"title":"Microball and thicker Cu Pad: A substrate solution for better package reliability and robustness on bumped devices","authors":"Jayson Rae Tulas, Tony Taloban","doi":"10.1109/EPTC.2015.7412341","DOIUrl":"https://doi.org/10.1109/EPTC.2015.7412341","url":null,"abstract":"The substrate design chosen for the newer Silicon (Si) node utilizes a low core thickness compared to previous Si nodes which used a high core thickness substrate. One motivation to move to low core thickness is the better electrical performance it could provide to the package, especially since most of the newer silicon technology devices are used for high powered applications. A low core substrate offers shorter routing for the current which minimizes the losses incurred during the travel of current from ball to die and vice versa. While it is better in terms of electrical performance, a low core thickness substrate presents new challenges in terms of manufacturability and reliability. Bump cracks and pad cracks were observed on the initial reliability tests. As such, the team collaborated with substrates suppliers to provide a solution that will make the newer silicon technology packages robust enough to withstand the adverse effects of package warpage, stress and solder voids. Microball (uBall), which is a new bumping technology and thicker Copper (Cu) pad are among the improvements in this paper. This paper also documents the root cause analysis, evaluations and verifications done to validate the effectiveness of identified corrective actions.","PeriodicalId":418705,"journal":{"name":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126112601","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Study on power cycling reliability of power module with single metal layer flexible substrate by finite element analysis 基于有限元分析的单金属层柔性基板电源模块功率循环可靠性研究

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Pub Date : 2015-12-01 DOI: 10.1109/EPTC.2015.7412307

Zhaohui Chen, How Yuan Hwang, N. Jaafar, D. Rhee

引用次数: 4

Cu-Cu bonding by Ag nanostructure at low temperature of 180 °C 低温180℃下银纳米结构的Cu-Cu键合

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Pub Date : 2015-12-01 DOI: 10.1109/EPTC.2015.7412274

Ziyu Liu, Qian Wang, Jian Cai, G. Zou, Lei Liu, Daozhi Shen, Lin Tan

{"title":"Cu-Cu bonding by Ag nanostructure at low temperature of 180 °C","authors":"Ziyu Liu, Qian Wang, Jian Cai, G. Zou, Lei Liu, Daozhi Shen, Lin Tan","doi":"10.1109/EPTC.2015.7412274","DOIUrl":"https://doi.org/10.1109/EPTC.2015.7412274","url":null,"abstract":"In order to lower Cu-Cu bonding temperature and shorten bonding time applied for 3D integration, nanostructure has been introduced on bonding Cu surface. However, few studies have been reported on Nano Particles (NPs) formation by film deposition process such as pulsed laser deposition (PLD), which would be compatible with CMOS process. In this work Ag nanostructure containing strings of NPs was formed by optimized PLD process, which is mostly used for nanofilm deposition. Then NPs morphology was observed by scanning electron microscope (SEM) and transmission electron microscopy (TEM). Ag nanostructure was consisted of strings of loose mesh structures filled with NPs with size range from several nanometers to tens of nanometers. They were compressible and of high movability, which was significantly benefit for lowering bonding temperature. With these Ag nanostructure on Cu pads, chips were pre-bonding at the low temperature of 180°C for 5 min and afterwards all the chips were simultaneously annealed at the temperature of 200 C for 25 min. After die shear test, average shear strength of 15.8 MPa was obtained and fracture surface was inspected by SEM. After TEM observation of bonding interface, continuous Cu-Ag-Cu interfaces with almost no void were observed. It confirmed low temperature Cu-Cu bonding with Ag nanostructure by PLD was a reliable and time-saving process, which might be a promising technology for 3D integration.","PeriodicalId":418705,"journal":{"name":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121334762","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Study the oxidation resistance on palladium-coated Free Air Ball 研究了包覆钯的自由空气球的抗氧化性

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Pub Date : 2015-12-01 DOI: 10.1109/EPTC.2015.7412413

L. Tang, Yue-Jia Zhang

{"title":"Study the oxidation resistance on palladium-coated Free Air Ball","authors":"L. Tang, Yue-Jia Zhang","doi":"10.1109/EPTC.2015.7412413","DOIUrl":"https://doi.org/10.1109/EPTC.2015.7412413","url":null,"abstract":"The use of Palladium-coated Copper (Pd-Cu) wire helps prevent Copper (Cu) oxidation before and during the bonding process. Different EFO current, firing time and ball size ratio (BSR), affect the roundness of the Free Air Balls (FABs) formed and the distribution of Pd on the surface of the FABs. In this paper, Pd-Cu wires of diameter 0.8 mil were used and 3 settings of Electronic Flame Off (EFO) current and firing time were used. Optical and scanning electron microscope (SEM) inspection were used to observe the shape of the FABs formed. Energy-dispersive X-ray spectroscopy (SEM-EDX) was carried out to observe the Pd distribution as well as the oxidation condition on the surface of the FABs. Other than the optical and SEM inspections, Focused Ion Beam (FIB) and Transmission electron microcopy (TEM) were carried out after a Pressure Cooker Test (PCT) to further investigate the corrosion phenomenon of Cu on FAB surfaces. It was found that for FAB surfaces which contain Pd, even if there is not complete coverage of Pd, the Cu oxidation is a slow process and that FABs with higher Pd content have better corrosion resistance performance. Cu Grain boundaries show the weakest location for corrosion resistance in the FAB.","PeriodicalId":418705,"journal":{"name":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121339363","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Study of barrier layer thickness effect for the micro-bump 微凸点阻挡层厚度效应研究

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Pub Date : 2015-12-01 DOI: 10.1109/EPTC.2015.7412328

H. Li, Norhanani Binte Jaafar, M. I. E. Sam, Kalyn Lim Tien Shee, Wong Lai Yin, Chui King Jien

引用次数: 0

A study balancing physical properties for an optimized thermal interface material 一种优化热界面材料的物理性质平衡研究

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Pub Date : 2015-12-01 DOI: 10.1109/EPTC.2015.7412273

L. Larson, Xiao Dong Wang, Yin Tang, A. Zambova

{"title":"A study balancing physical properties for an optimized thermal interface material","authors":"L. Larson, Xiao Dong Wang, Yin Tang, A. Zambova","doi":"10.1109/EPTC.2015.7412273","DOIUrl":"https://doi.org/10.1109/EPTC.2015.7412273","url":null,"abstract":"Thermal dissipation requirements for advanced flip chip devices are becoming significant. High end flip chip devices that used lidded packages are now being redesigned to utilize even more advanced materials. Devices that previously did not require a lidded package are now being forced to utilize such a package. The latter scenario can also can benefit from more advanced materials. Initial thermal performance is a key factor for selecting a candidate thermal interface material (TIM), but how well the package can survive reliability conditions is also important. Cost pressures on the overall structural design can also be a significant factor for some types of applications. Polymeric TIMs can address many of these issues by having a high initial thermal performance and by allowing adequate mechanical stress relief to survive reliability conditions. The TIM properties, such as elongation and modulus can be as important as the thermal conductivity. Properties such as thermal resistance and thermal impedance are even more important. This paper will detail how these properties are inter-related and will demonstrate that an optimum balance between them can be achieved.","PeriodicalId":418705,"journal":{"name":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121519203","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0