Study of barrier layer thickness effect for the micro-bump

Abstract

With the semiconductor development, more and more different devices need be integrated to achieve faster and more functionalities. Micro-bump is an important connection from chip to chip, chip to wafer and chip to substrate. We evaluated micro-bump barrier layer Ti thicknesses (400Å, 1KÅ and 2KÅ) effect on shear strength and bump chain resistance in this study.