一种优化热界面材料的物理性质平衡研究

L. Larson, Xiao Dong Wang, Yin Tang, A. Zambova
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引用次数: 0

摘要

对先进倒装芯片器件的散热要求正变得越来越重要。使用盖封装的高端倒装芯片设备现在正在重新设计,以使用更先进的材料。以前不需要盒式封装的设备现在被迫使用这种封装。后一种情况也可以从更先进的材料中受益。初始热性能是选择候选热界面材料(TIM)的关键因素,但封装在可靠性条件下的生存能力也很重要。对于某些类型的应用,整体结构设计的成本压力也可能是一个重要因素。聚合物TIMs可以通过具有较高的初始热性能和足够的机械应力消除来解决这些问题。TIM的性能,如伸长率和模量可以和导热系数一样重要。热阻和热阻抗等特性更为重要。本文将详细介绍这些属性是如何相互关联的,并将证明它们之间可以实现最佳平衡。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A study balancing physical properties for an optimized thermal interface material
Thermal dissipation requirements for advanced flip chip devices are becoming significant. High end flip chip devices that used lidded packages are now being redesigned to utilize even more advanced materials. Devices that previously did not require a lidded package are now being forced to utilize such a package. The latter scenario can also can benefit from more advanced materials. Initial thermal performance is a key factor for selecting a candidate thermal interface material (TIM), but how well the package can survive reliability conditions is also important. Cost pressures on the overall structural design can also be a significant factor for some types of applications. Polymeric TIMs can address many of these issues by having a high initial thermal performance and by allowing adequate mechanical stress relief to survive reliability conditions. The TIM properties, such as elongation and modulus can be as important as the thermal conductivity. Properties such as thermal resistance and thermal impedance are even more important. This paper will detail how these properties are inter-related and will demonstrate that an optimum balance between them can be achieved.
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