倒装封装用柔性铜柱的研制

B. Jung, F. Che, Jong-Kai Lin
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引用次数: 3

摘要

本文提出了一种基于铜柱内聚合物芯、聚合物封装铜柱的柔性倒装芯片凸包设计方案,并给出了小间距倒装芯片凸包的工艺流程。聚合物芯结构和聚合物封装铜柱结构都能提供对铜柱结构的顺应性,并降低低K介电层上的应力。结构分析表明,与传统的铜柱结构相比,聚合物包封凸起和聚合物芯凸起分别降低了35%和20%的低K介电应力。此外,两种柔性凸点结构(聚合物封装和聚合物芯凸点)分别将焊点热循环寿命延长55%和30%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Development of compliant Cu pillar for flip chip package
A compliant flip chip bump design compromises of a polymer core inside a Cu pillar, a polymer encapsulated Cu pillar and the process flow to make such bumps for fine pitch flip chip package is proposed in this study. Both polymer core and polymer encapsulated Cu pillar structures are able to provide the compliance to the Cu pillar structure and reduce stress on low K dielectric layers. A structural analysis showed the polymer encapsulated bump and polymer core bump reduce the low K dielectric stress by 35% and 20%, respectively, compared to conventional Cu pillar structure. Also both compliant bump structures (polymer encapsulated and polymer core bump) increase solder joint thermal cycle life time by 55% and 30%, respectively.
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