微凸点阻挡层厚度效应研究

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Pub Date : 2015-12-01 DOI:10.1109/EPTC.2015.7412328

H. Li, Norhanani Binte Jaafar, M. I. E. Sam, Kalyn Lim Tien Shee, Wong Lai Yin, Chui King Jien

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引用次数: 0

摘要

随着半导体的发展，越来越多不同的器件需要集成以实现更快、更多功能。微凸点是芯片与芯片、芯片与晶圆、芯片与衬底之间的重要连接。在本研究中，我们评估了微碰撞阻挡层Ti厚度(400Å， 1KÅ和2KÅ)对抗剪强度和碰撞链阻力的影响。

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Study of barrier layer thickness effect for the micro-bump

With the semiconductor development, more and more different devices need be integrated to achieve faster and more functionalities. Micro-bump is an important connection from chip to chip, chip to wafer and chip to substrate. We evaluated micro-bump barrier layer Ti thicknesses (400Å, 1KÅ and 2KÅ) effect on shear strength and bump chain resistance in this study.

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2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

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