基于有限元分析的单金属层柔性基板电源模块功率循环可靠性研究

Zhaohui Chen, How Yuan Hwang, N. Jaafar, D. Rhee
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引用次数: 4

摘要

为研究单金属层柔性基板电力电子封装试验车的热机械可靠性,建立了功率循环仿真模型。功率循环仿真包括热分析和热力学分析。通过热分析得到了大功率电子封装的温度分布。采用热-力耦合模拟方法,研究了电力电子封装的模具贴接材料和铝键合线的应力应变行为。采用基于塑性应变的Coffin-Manson疲劳寿命预测模型对模具连接材料和铝焊丝的疲劳寿命进行了预测。通过参数化研究,结合数值模拟结果,探讨了模具材料、环氧树脂复合材料和模具附着材料的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Study on power cycling reliability of power module with single metal layer flexible substrate by finite element analysis
In this paper, the power cycling simulation model was built up to study the thermo-mechanical reliability of the power electronic package test vehicle with single metal layer flexible substrate. The power cycling simulation includes thermal analysis and thermo-mechanical analysis. The temperature distribution of the high power electronic package was obtained by the thermal analysis. The stress and strain behaviors of the die attach materials and Al bonding wires of the power electronic package were investigated by the coupled thermo-mechanical simulation. The fatigue lives of the die attach materials and Al bonding wires were estimated by the plastic-strain based Coffin-Manson fatigue life prediction model. The effects of the die materials, epoxy molding compound (EMC) and die attach materials were also investigated by the parametric studies with the numerical simulation results.
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