微球和更厚的铜衬垫:在碰撞器件上提供更好的封装可靠性和稳健性的衬底解决方案

Jayson Rae Tulas, Tony Taloban
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引用次数: 0

摘要

与先前使用高芯厚衬底的Si节点相比,为新硅(Si)节点选择的衬底设计利用了低芯厚度。转向低芯厚的一个动机是它可以为封装提供更好的电气性能,特别是因为大多数较新的硅技术设备都用于高功率应用。低芯基板为电流提供了更短的路由,从而最大限度地减少了电流从球到芯的传播过程中产生的损耗,反之亦然。虽然它在电气性能方面更好,但低芯厚基板在可制造性和可靠性方面提出了新的挑战。在初始可靠性试验中观察到凹凸裂纹和垫块裂纹。因此,该团队与基板供应商合作提供了一种解决方案,该解决方案将使更新的硅技术封装足够坚固,以承受封装翘曲,应力和焊接空洞的不利影响。微球(uBall)是一种新的碰撞技术,铜衬垫厚度也有所提高。本文件还记录了根本原因分析、评估和验证,以确认已确定的纠正措施的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Microball and thicker Cu Pad: A substrate solution for better package reliability and robustness on bumped devices
The substrate design chosen for the newer Silicon (Si) node utilizes a low core thickness compared to previous Si nodes which used a high core thickness substrate. One motivation to move to low core thickness is the better electrical performance it could provide to the package, especially since most of the newer silicon technology devices are used for high powered applications. A low core substrate offers shorter routing for the current which minimizes the losses incurred during the travel of current from ball to die and vice versa. While it is better in terms of electrical performance, a low core thickness substrate presents new challenges in terms of manufacturability and reliability. Bump cracks and pad cracks were observed on the initial reliability tests. As such, the team collaborated with substrates suppliers to provide a solution that will make the newer silicon technology packages robust enough to withstand the adverse effects of package warpage, stress and solder voids. Microball (uBall), which is a new bumping technology and thicker Copper (Cu) pad are among the improvements in this paper. This paper also documents the root cause analysis, evaluations and verifications done to validate the effectiveness of identified corrective actions.
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