低温180℃下银纳米结构的Cu-Cu键合

Ziyu Liu, Qian Wang, Jian Cai, G. Zou, Lei Liu, Daozhi Shen, Lin Tan
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引用次数: 6

摘要

为了降低Cu-Cu键合温度和缩短键合时间,在Cu键合表面引入了纳米结构。然而,利用脉冲激光沉积(PLD)等薄膜沉积工艺制备纳米粒子(NPs),与CMOS工艺兼容的研究却很少。本文采用优化的PLD工艺制备了含有纳米粒子串的银纳米结构,该工艺主要用于纳米膜的沉积。然后用扫描电镜(SEM)和透射电镜(TEM)观察NPs的形态。银纳米结构由一系列松散的网状结构组成,其中填充了大小从几纳米到几十纳米不等的纳米粒子。它们具有可压缩性和高流动性,这对降低键合温度有显著的好处。将这些Ag纳米结构置于Cu衬垫上,在180℃低温下预粘接5 min,然后在200℃温度下同时退火25 min。经过模剪试验,得到平均抗剪强度为15.8 MPa,并通过SEM观察断口形貌。通过TEM观察键合界面,可以看到连续的Cu-Ag-Cu界面,几乎没有空洞。这证实了低温Cu-Cu与Ag纳米结构的键合是一种可靠且省时的工艺,可能是一种有前途的3D集成技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Cu-Cu bonding by Ag nanostructure at low temperature of 180 °C
In order to lower Cu-Cu bonding temperature and shorten bonding time applied for 3D integration, nanostructure has been introduced on bonding Cu surface. However, few studies have been reported on Nano Particles (NPs) formation by film deposition process such as pulsed laser deposition (PLD), which would be compatible with CMOS process. In this work Ag nanostructure containing strings of NPs was formed by optimized PLD process, which is mostly used for nanofilm deposition. Then NPs morphology was observed by scanning electron microscope (SEM) and transmission electron microscopy (TEM). Ag nanostructure was consisted of strings of loose mesh structures filled with NPs with size range from several nanometers to tens of nanometers. They were compressible and of high movability, which was significantly benefit for lowering bonding temperature. With these Ag nanostructure on Cu pads, chips were pre-bonding at the low temperature of 180°C for 5 min and afterwards all the chips were simultaneously annealed at the temperature of 200 C for 25 min. After die shear test, average shear strength of 15.8 MPa was obtained and fracture surface was inspected by SEM. After TEM observation of bonding interface, continuous Cu-Ag-Cu interfaces with almost no void were observed. It confirmed low temperature Cu-Cu bonding with Ag nanostructure by PLD was a reliable and time-saving process, which might be a promising technology for 3D integration.
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