{"title":"基于剥离能量-剥离速度耦合的多圆盘抛射器从晶圆带上取模的动态模拟","authors":"S. Behler","doi":"10.1109/EPTC.2015.7412268","DOIUrl":null,"url":null,"abstract":"A 2D simulation of thin die peeling from wafer tape is presented for a Multi Disc ejection system. The simulation models the dynamics of peeling, and visualizes time-dependency of peel front propagation and target die stress. It is based on a series of static snapshots, stringed together like a movie. A coupling of peel energy and peel velocity is defined. This allows to calculate the geometry of the actual snapshot by the peel energy of the preceding one. As a result, experimental data of a peel process can be verified. It is shown, why an increase in disc velocity leads to a slow-down of peel front propagation, and thus to a pickup failure.","PeriodicalId":418705,"journal":{"name":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","volume":"162 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Dynamic simulation of die pickup from wafer tape by a multi-disc ejector using peel-energy to peel-velocity coupling\",\"authors\":\"S. Behler\",\"doi\":\"10.1109/EPTC.2015.7412268\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A 2D simulation of thin die peeling from wafer tape is presented for a Multi Disc ejection system. The simulation models the dynamics of peeling, and visualizes time-dependency of peel front propagation and target die stress. It is based on a series of static snapshots, stringed together like a movie. A coupling of peel energy and peel velocity is defined. This allows to calculate the geometry of the actual snapshot by the peel energy of the preceding one. As a result, experimental data of a peel process can be verified. It is shown, why an increase in disc velocity leads to a slow-down of peel front propagation, and thus to a pickup failure.\",\"PeriodicalId\":418705,\"journal\":{\"name\":\"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)\",\"volume\":\"162 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2015.7412268\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2015.7412268","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Dynamic simulation of die pickup from wafer tape by a multi-disc ejector using peel-energy to peel-velocity coupling
A 2D simulation of thin die peeling from wafer tape is presented for a Multi Disc ejection system. The simulation models the dynamics of peeling, and visualizes time-dependency of peel front propagation and target die stress. It is based on a series of static snapshots, stringed together like a movie. A coupling of peel energy and peel velocity is defined. This allows to calculate the geometry of the actual snapshot by the peel energy of the preceding one. As a result, experimental data of a peel process can be verified. It is shown, why an increase in disc velocity leads to a slow-down of peel front propagation, and thus to a pickup failure.