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Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92最新文献

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Full wave electrical modeling of MCM by robust design methodology 基于稳健设计方法的MCM全波电建模
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201453
A. Iqbal
{"title":"Full wave electrical modeling of MCM by robust design methodology","authors":"A. Iqbal","doi":"10.1109/MCMC.1992.201453","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201453","url":null,"abstract":"The author describes the modeling of a glass ceramic multichip module (MCM) by using statistical design techniques. The electrical design of the MCM was achieved by a robust design technique using a full-wave electromagnetic solver. The design point was determined by modeling a five-level fractional factorial matrix covering the full range of the process capabilities. The design point yielded a 50- Omega characteristic impedance and a near-end noise of <5% of the logic swing.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"130 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124244230","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Fine pitch pad array carrier sockets for multichip modules 用于多芯片模块的细间距垫阵列载波插座
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201442
J. Trent, G. Westbrook
{"title":"Fine pitch pad array carrier sockets for multichip modules","authors":"J. Trent, G. Westbrook","doi":"10.1109/MCMC.1992.201442","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201442","url":null,"abstract":"A project is currently under way to develop two pad array carrier (PAC) multichip modules using Motorola's H4C123 ASIC family as a test vehicle. A brief summary of Motorola's multichip module test vehicle is first presented. Then, a comparison of three different connector technologies is provided. A limited number of socket manufacturers were evaluated. The main parameters considered from vendor to vendor were contact pitch, contact repairability, clamping force, resistance per contact, inductance per contact, capacitance per contact, insulator resistance, heat sink attach area, availability of comprehensive test data performed on the product, and cost. A discussion of design considerations is included. Two different socket technologies were selected for a 50 and a 100 mil pitch multichip module.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"113 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122946400","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
IBM ES/9000 buried engineering change modeling for verification (MCM) IBM ES/9000嵌入式工程变更建模验证(MCM)
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201476
C. Selinger, C. Vakirtzis
{"title":"IBM ES/9000 buried engineering change modeling for verification (MCM)","authors":"C. Selinger, C. Vakirtzis","doi":"10.1109/MCMC.1992.201476","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201476","url":null,"abstract":"Buried engineering change (BEC) is a method of laying out engineering change (EC) wires within a multichip module (MCM) at the original building time for later use. The authors discuss the modeling used to accurately predict delay, validate electrical integrity, and add a degree of flexibility to the wiring process. The purpose of developing this BEC modeling methodology was to provide fast, accurate electrical verification and timing without using slower circuit modeling tools on individual nets. By modeling classes of nets an equivalent model concept was developed that provided fast timing and verification of all nets. This modeling methodology centers around maintaining the original modeling structure for a net that is physically different when engineering-changed. The IBM ES/9000 timing and verification tools accurately predicted net timing for BEC nets.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"23 6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130636652","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
High-performance MCM interconnection circuits and fluxoelectronics 高性能MCM互连电路和磁控电子学
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201478
U. Ghoshal, T. Van Duzer
{"title":"High-performance MCM interconnection circuits and fluxoelectronics","authors":"U. Ghoshal, T. Van Duzer","doi":"10.1109/MCMC.1992.201478","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201478","url":null,"abstract":"The authors describe the benefits of air-dielectric interconnections and fluxoelectronic interconnection circuits in high-performance multichip modules (MCMS). Not only do superconductors provide low-loss, dispersionless interconnection, but they also provide low-power, high-speed alternatives to conventional interconnection circuits. The low current levels in fluxoelectronic methods and low-voltage interconnection circuits and the freedom from dielectric considerations in air-dielectric interconnections may be important for developing MCMs using high-temperature superconductors.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"164 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131399061","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An integrated approach for electrical performance analysis of multichip modules 多芯片模块电气性能分析的集成方法
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201455
J. Liao, G.N. Choksi
{"title":"An integrated approach for electrical performance analysis of multichip modules","authors":"J. Liao, G.N. Choksi","doi":"10.1109/MCMC.1992.201455","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201455","url":null,"abstract":"The authors describe an integrated approach to evaluate the electrical performance of multichip modules. A software system consisting of modeling and simulation tools to extract geometry from a placement and routing system, compute electrical parasiticsm, and create equivalent circuit files to perform circuit simulations has been developed. This tool was used in designing an i486 microprocessor-based multichip module. Typical results from the analysis are presented.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"214 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117337176","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Silicon-on-silicon technology for CMOS-based computer systems 基于cmos的计算机系统的硅对硅技术
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201433
T. Sudo
{"title":"Silicon-on-silicon technology for CMOS-based computer systems","authors":"T. Sudo","doi":"10.1109/MCMC.1992.201433","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201433","url":null,"abstract":"The main features of Si-on-Si technology are outlined. The electrical design of the wiring substrate is described, and chip connection and thermal design issues are addressed. Several options for mechanically supporting a large Si substrate are considered. A digital signal processing module developed using chip-on-wafer technology is discussed as an example. AlN ceramic was found to be an excellent packaging material to mechanically support a large Si substrate with high reliability.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121174745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
An overlay interconnect technology for 1 GHz and above MCMs 用于1ghz及以上mcm的覆盖互连技术
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201477
M. Gdula, W. Kornrumpf, B. Gilbert
{"title":"An overlay interconnect technology for 1 GHz and above MCMs","authors":"M. Gdula, W. Kornrumpf, B. Gilbert","doi":"10.1109/MCMC.1992.201477","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201477","url":null,"abstract":"An overlay interconnect technology is presented that is suitable for 1 GHz and above operation of GaAs and Si multichip module (MCM) circuits. This technology encompasses a back side bonded, chips first approach with an adaptive laser photolithography defined multilayer overlay interconnect providing consistent line impedances with low crosstalk and signal delay. Signal propagation velocities of 18 cm/ns have been demonstrated on lines with an insertion loss of 0.25 dB/cm at 10 GHz. This interconnect system has been used to interconnect GaAs digital circuits operating at clock frequencies of 2.0 GHz without power supply bypass capacitors.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126702070","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Simulation and optimization of interconnect delay and crosstalk in multi-chip modules 多芯片模块互连延迟和串扰的仿真与优化
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201446
M. Nakhla, Q. Zhang
{"title":"Simulation and optimization of interconnect delay and crosstalk in multi-chip modules","authors":"M. Nakhla, Q. Zhang","doi":"10.1109/MCMC.1992.201446","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201446","url":null,"abstract":"As signal speeds increase, interconnect effects such as delay, distortion and crosstalk become the dominant factor limiting the overall performance of a multichip module. The authors outline efficient techniques recently developed for addressing three specific aspects of the high-speed interconnect problem, namely, simulation, sensitivity analysis and performance optimization. These techniques accommodate distributed interconnect models represented by lossy coupled transmission lines. Two examples showing the applications of these techniques are included.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116552570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Design of a silicon-on-silicon multi-chip module for a high-performance Ps/2 workstation 高性能Ps/2工作站用硅对硅多芯片模块的设计
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201460
W. E. Pence, D. McQueeney, J. Mosley
{"title":"Design of a silicon-on-silicon multi-chip module for a high-performance Ps/2 workstation","authors":"W. E. Pence, D. McQueeney, J. Mosley","doi":"10.1109/MCMC.1992.201460","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201460","url":null,"abstract":"A silicon-on-silicon multichip module design, which addresses several issues unique to low-end machines, is described. Among these are mixing bipolar and CMOS chips, practicing flip-chip and wirebonding on the same substrate, and customizing the power plane to supply multiple voltage levels. Following a description of the module design, the issue of performance in microprocessor-based machines as a driver for multichip module technology is discussed.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132673852","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Perspectives on multi-chip modules: substrate alternatives 多晶片模组展望:基板替代方案
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201434
L. Higgins
{"title":"Perspectives on multi-chip modules: substrate alternatives","authors":"L. Higgins","doi":"10.1109/MCMC.1992.201434","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201434","url":null,"abstract":"A summary of the multichip module (MCM) features commonly mentioned in the literature and by designers, users, and would-be users is given. The current assessment of the many advantages offered by MCM-D indicates the technology will fill the needs of high-performance systems well into the future, but printed wiring board (PWB) modules (MCM-L) can provide solutions now. The rationale for expanded use is discussed. MCM-L represents the most logical substrate technology for use in the current and next-generation personal computers, workstations, and communication equipment. The bulk of these systems will not need the routing density of MCM-D.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130418035","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
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