高性能Ps/2工作站用硅对硅多芯片模块的设计

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI:10.1109/MCMC.1992.201460

W. E. Pence, D. McQueeney, J. Mosley

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引用次数: 4

摘要

描述了一种硅对硅多芯片模块设计，它解决了低端机器所特有的几个问题。其中包括混合双极和CMOS芯片，在同一衬底上实践倒装芯片和线键，以及定制电源平面以提供多个电压水平。在描述了模块设计之后，讨论了基于微处理器的机器作为多芯片模块技术驱动程序的性能问题

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Design of a silicon-on-silicon multi-chip module for a high-performance Ps/2 workstation

A silicon-on-silicon multichip module design, which addresses several issues unique to low-end machines, is described. Among these are mixing bipolar and CMOS chips, practicing flip-chip and wirebonding on the same substrate, and customizing the power plane to supply multiple voltage levels. Following a description of the module design, the issue of performance in microprocessor-based machines as a driver for multichip module technology is discussed.<>

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Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92

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