基于cmos的计算机系统的硅对硅技术

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI:10.1109/MCMC.1992.201433

T. Sudo

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引用次数: 8

摘要

概述了Si-on-Si技术的主要特点。描述了布线基板的电气设计，并解决了芯片连接和热设计问题。考虑了机械支撑大型硅衬底的几种选择。并以采用片上芯片技术开发的数字信号处理模块为例进行了讨论。AlN陶瓷被认为是一种优良的封装材料，可以机械地支持具有高可靠性的大型Si衬底。

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Silicon-on-silicon technology for CMOS-based computer systems

The main features of Si-on-Si technology are outlined. The electrical design of the wiring substrate is described, and chip connection and thermal design issues are addressed. Several options for mechanically supporting a large Si substrate are considered. A digital signal processing module developed using chip-on-wafer technology is discussed as an example. AlN ceramic was found to be an excellent packaging material to mechanically support a large Si substrate with high reliability.<>

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Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92

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