{"title":"多晶片模组展望:基板替代方案","authors":"L. Higgins","doi":"10.1109/MCMC.1992.201434","DOIUrl":null,"url":null,"abstract":"A summary of the multichip module (MCM) features commonly mentioned in the literature and by designers, users, and would-be users is given. The current assessment of the many advantages offered by MCM-D indicates the technology will fill the needs of high-performance systems well into the future, but printed wiring board (PWB) modules (MCM-L) can provide solutions now. The rationale for expanded use is discussed. MCM-L represents the most logical substrate technology for use in the current and next-generation personal computers, workstations, and communication equipment. The bulk of these systems will not need the routing density of MCM-D.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Perspectives on multi-chip modules: substrate alternatives\",\"authors\":\"L. Higgins\",\"doi\":\"10.1109/MCMC.1992.201434\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A summary of the multichip module (MCM) features commonly mentioned in the literature and by designers, users, and would-be users is given. The current assessment of the many advantages offered by MCM-D indicates the technology will fill the needs of high-performance systems well into the future, but printed wiring board (PWB) modules (MCM-L) can provide solutions now. The rationale for expanded use is discussed. MCM-L represents the most logical substrate technology for use in the current and next-generation personal computers, workstations, and communication equipment. The bulk of these systems will not need the routing density of MCM-D.<<ETX>>\",\"PeriodicalId\":202574,\"journal\":{\"name\":\"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-03-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1992.201434\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1992.201434","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Perspectives on multi-chip modules: substrate alternatives
A summary of the multichip module (MCM) features commonly mentioned in the literature and by designers, users, and would-be users is given. The current assessment of the many advantages offered by MCM-D indicates the technology will fill the needs of high-performance systems well into the future, but printed wiring board (PWB) modules (MCM-L) can provide solutions now. The rationale for expanded use is discussed. MCM-L represents the most logical substrate technology for use in the current and next-generation personal computers, workstations, and communication equipment. The bulk of these systems will not need the routing density of MCM-D.<>
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
