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Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92最新文献

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Trends in processor and system design and the interaction with advanced packaging 处理器和系统设计的趋势以及与先进封装的相互作用
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201431
J. Hennessy
{"title":"Trends in processor and system design and the interaction with advanced packaging","authors":"J. Hennessy","doi":"10.1109/MCMC.1992.201431","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201431","url":null,"abstract":"The author briefly looks at trends in microprocessor development and system architecture. A detailed discussion of the system designer's challenges and of how an advanced packaging technology might help is presented. Trends in processor design, trends in system design, and opportunities and challenges for packaging technology are considered.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128792228","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A multi-chip module for hand-held digital cellular mobile telephone 一种用于手持式蜂窝式数字移动电话的多芯片模块
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201462
S. Bang, B. Sheu
{"title":"A multi-chip module for hand-held digital cellular mobile telephone","authors":"S. Bang, B. Sheu","doi":"10.1109/MCMC.1992.201462","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201462","url":null,"abstract":"The design of a dedicated multichip module (MCM) for hand-held digital cellular telephones is presented. It uses the silicon-on-silicon, flip-chip MCM technology. The MCM contains one gallium arsenide and seven CMOS VLSI chips and performs receive front-ending, all baseband signal processing, and system control functions. High frequency effects are briefly discussed.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116586353","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Peripheral circuit design for field programmable MCM systems 现场可编程MCM系统外围电路设计
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201463
I. Dobbelaere, A. El Gamal, D. How, B. Kleveland
{"title":"Peripheral circuit design for field programmable MCM systems","authors":"I. Dobbelaere, A. El Gamal, D. How, B. Kleveland","doi":"10.1109/MCMC.1992.201463","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201463","url":null,"abstract":"A field programmable multichip module (MCM) architecture utilizing an array of modified field-programmable gate arrays (FPGAs) is proposed. Interconnections are provided by a fixed wiring network on the MCM, and by programmable interconnection frames on each FPGA. It is shown that full-swing CMOS peripheral circuits are faster than low-swing CMOS circuits. Buffering configurations for the interconnection frame which exploit the MCM performance benefits were selected and optimized. Bidirectional bus implementations using the frame are presented.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123982358","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Yield modeling of MCM assembly with flip-chip thermocompression bondings 具有倒装芯片热压键合的MCM组件的屈服建模
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201449
S. Kang, Y.C. Lee
{"title":"Yield modeling of MCM assembly with flip-chip thermocompression bondings","authors":"S. Kang, Y.C. Lee","doi":"10.1109/MCMC.1992.201449","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201449","url":null,"abstract":"Flip-chip connections using gold-to-gold, gold-to-aluminum, or gold-to-solder bondings or contacts enhanced by epoxy are low-cost alternatives to soldering. A yield model has been developed for flip-chip, thermocompression bondings. The model predicts the assembly yield as a function of forces and planarities of the end effector, bump height variations, bump geometries, mechanical properties corresponding to different materials and temperatures, and distribution patterns of bumps. The model calculates the deformation of each gold bump under different assembly conditions, and determines if the bonding is good, with a 15 to 45% range, or bad.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126621888","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Early system analysis of cache performance for RISC systems RISC系统缓存性能的早期系统分析
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-01 DOI: 10.1109/MCMC.1992.201466
J. D. Roberts, W. Dai
{"title":"Early system analysis of cache performance for RISC systems","authors":"J. D. Roberts, W. Dai","doi":"10.1109/MCMC.1992.201466","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201466","url":null,"abstract":"The implications of packaging and interconnection technologies for reduced instruction set computing (RISC) microprocessor memory hierarchies are examined. Prior early analysis tools have taken either cache performance or interconnection models into consideration. Here such analyses are combined and extended to be more specific to RISC microprocessor cache systems. The resulting first-order model allows interactive investigation of tradeoffs at prenetlist phases of design. After summarizing the model, several test cases are presented which illustrate trends and begin to quantify design tradeoffs.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130242684","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
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