具有倒装芯片热压键合的MCM组件的屈服建模

S. Kang, Y.C. Lee
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引用次数: 2

摘要

使用金对金、金对铝或金对焊料粘合或环氧树脂增强触点的倒装芯片连接是焊接的低成本替代品。开发了倒装芯片热压键合的屈服模型。该模型预测了装配良率作为末端执行器的力和平面度、碰撞高度变化、碰撞几何形状、不同材料和温度对应的机械性能以及碰撞分布模式的函数。该模型计算了不同装配条件下每个金肿块的变形,并确定粘接是好还是坏,粘接范围在15%到45%之间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Yield modeling of MCM assembly with flip-chip thermocompression bondings
Flip-chip connections using gold-to-gold, gold-to-aluminum, or gold-to-solder bondings or contacts enhanced by epoxy are low-cost alternatives to soldering. A yield model has been developed for flip-chip, thermocompression bondings. The model predicts the assembly yield as a function of forces and planarities of the end effector, bump height variations, bump geometries, mechanical properties corresponding to different materials and temperatures, and distribution patterns of bumps. The model calculates the deformation of each gold bump under different assembly conditions, and determines if the bonding is good, with a 15 to 45% range, or bad.<>
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