{"title":"具有倒装芯片热压键合的MCM组件的屈服建模","authors":"S. Kang, Y.C. Lee","doi":"10.1109/MCMC.1992.201449","DOIUrl":null,"url":null,"abstract":"Flip-chip connections using gold-to-gold, gold-to-aluminum, or gold-to-solder bondings or contacts enhanced by epoxy are low-cost alternatives to soldering. A yield model has been developed for flip-chip, thermocompression bondings. The model predicts the assembly yield as a function of forces and planarities of the end effector, bump height variations, bump geometries, mechanical properties corresponding to different materials and temperatures, and distribution patterns of bumps. The model calculates the deformation of each gold bump under different assembly conditions, and determines if the bonding is good, with a 15 to 45% range, or bad.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Yield modeling of MCM assembly with flip-chip thermocompression bondings\",\"authors\":\"S. Kang, Y.C. Lee\",\"doi\":\"10.1109/MCMC.1992.201449\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Flip-chip connections using gold-to-gold, gold-to-aluminum, or gold-to-solder bondings or contacts enhanced by epoxy are low-cost alternatives to soldering. A yield model has been developed for flip-chip, thermocompression bondings. The model predicts the assembly yield as a function of forces and planarities of the end effector, bump height variations, bump geometries, mechanical properties corresponding to different materials and temperatures, and distribution patterns of bumps. The model calculates the deformation of each gold bump under different assembly conditions, and determines if the bonding is good, with a 15 to 45% range, or bad.<<ETX>>\",\"PeriodicalId\":202574,\"journal\":{\"name\":\"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-03-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1992.201449\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1992.201449","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Yield modeling of MCM assembly with flip-chip thermocompression bondings
Flip-chip connections using gold-to-gold, gold-to-aluminum, or gold-to-solder bondings or contacts enhanced by epoxy are low-cost alternatives to soldering. A yield model has been developed for flip-chip, thermocompression bondings. The model predicts the assembly yield as a function of forces and planarities of the end effector, bump height variations, bump geometries, mechanical properties corresponding to different materials and temperatures, and distribution patterns of bumps. The model calculates the deformation of each gold bump under different assembly conditions, and determines if the bonding is good, with a 15 to 45% range, or bad.<>