{"title":"Trends in processor and system design and the interaction with advanced packaging","authors":"J. Hennessy","doi":"10.1109/MCMC.1992.201431","DOIUrl":null,"url":null,"abstract":"The author briefly looks at trends in microprocessor development and system architecture. A detailed discussion of the system designer's challenges and of how an advanced packaging technology might help is presented. Trends in processor design, trends in system design, and opportunities and challenges for packaging technology are considered.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"44 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1992.201431","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The author briefly looks at trends in microprocessor development and system architecture. A detailed discussion of the system designer's challenges and of how an advanced packaging technology might help is presented. Trends in processor design, trends in system design, and opportunities and challenges for packaging technology are considered.<>