{"title":"一种用于手持式蜂窝式数字移动电话的多芯片模块","authors":"S. Bang, B. Sheu","doi":"10.1109/MCMC.1992.201462","DOIUrl":null,"url":null,"abstract":"The design of a dedicated multichip module (MCM) for hand-held digital cellular telephones is presented. It uses the silicon-on-silicon, flip-chip MCM technology. The MCM contains one gallium arsenide and seven CMOS VLSI chips and performs receive front-ending, all baseband signal processing, and system control functions. High frequency effects are briefly discussed.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"64 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A multi-chip module for hand-held digital cellular mobile telephone\",\"authors\":\"S. Bang, B. Sheu\",\"doi\":\"10.1109/MCMC.1992.201462\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The design of a dedicated multichip module (MCM) for hand-held digital cellular telephones is presented. It uses the silicon-on-silicon, flip-chip MCM technology. The MCM contains one gallium arsenide and seven CMOS VLSI chips and performs receive front-ending, all baseband signal processing, and system control functions. High frequency effects are briefly discussed.<<ETX>>\",\"PeriodicalId\":202574,\"journal\":{\"name\":\"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92\",\"volume\":\"64 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-03-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1992.201462\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1992.201462","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A multi-chip module for hand-held digital cellular mobile telephone
The design of a dedicated multichip module (MCM) for hand-held digital cellular telephones is presented. It uses the silicon-on-silicon, flip-chip MCM technology. The MCM contains one gallium arsenide and seven CMOS VLSI chips and performs receive front-ending, all baseband signal processing, and system control functions. High frequency effects are briefly discussed.<>