处理器和系统设计的趋势以及与先进封装的相互作用

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI:10.1109/MCMC.1992.201431

J. Hennessy

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引用次数: 2

摘要

作者简要介绍了微处理器的发展趋势和系统架构。详细讨论了系统设计人员面临的挑战以及先进的封装技术如何提供帮助。考虑了处理器设计的趋势、系统设计的趋势以及封装技术的机遇和挑战。

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Trends in processor and system design and the interaction with advanced packaging

The author briefly looks at trends in microprocessor development and system architecture. A detailed discussion of the system designer's challenges and of how an advanced packaging technology might help is presented. Trends in processor design, trends in system design, and opportunities and challenges for packaging technology are considered.<>

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Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92

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