High-performance MCM interconnection circuits and fluxoelectronics

Abstract

The authors describe the benefits of air-dielectric interconnections and fluxoelectronic interconnection circuits in high-performance multichip modules (MCMS). Not only do superconductors provide low-loss, dispersionless interconnection, but they also provide low-power, high-speed alternatives to conventional interconnection circuits. The low current levels in fluxoelectronic methods and low-voltage interconnection circuits and the freedom from dielectric considerations in air-dielectric interconnections may be important for developing MCMs using high-temperature superconductors.<>