An integrated approach for electrical performance analysis of multichip modules

J. Liao, G.N. Choksi
{"title":"An integrated approach for electrical performance analysis of multichip modules","authors":"J. Liao, G.N. Choksi","doi":"10.1109/MCMC.1992.201455","DOIUrl":null,"url":null,"abstract":"The authors describe an integrated approach to evaluate the electrical performance of multichip modules. A software system consisting of modeling and simulation tools to extract geometry from a placement and routing system, compute electrical parasiticsm, and create equivalent circuit files to perform circuit simulations has been developed. This tool was used in designing an i486 microprocessor-based multichip module. Typical results from the analysis are presented.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"214 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1992.201455","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

The authors describe an integrated approach to evaluate the electrical performance of multichip modules. A software system consisting of modeling and simulation tools to extract geometry from a placement and routing system, compute electrical parasiticsm, and create equivalent circuit files to perform circuit simulations has been developed. This tool was used in designing an i486 microprocessor-based multichip module. Typical results from the analysis are presented.<>
多芯片模块电气性能分析的集成方法
作者描述了一种综合的方法来评估多芯片模块的电气性能。开发了一个由建模和仿真工具组成的软件系统,用于从放置和布线系统中提取几何形状,计算电寄生,并创建等效电路文件以执行电路仿真。利用该工具设计了一个基于i486微处理器的多芯片模块。给出了典型的分析结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信