Perspectives on multi-chip modules: substrate alternatives

Abstract

A summary of the multichip module (MCM) features commonly mentioned in the literature and by designers, users, and would-be users is given. The current assessment of the many advantages offered by MCM-D indicates the technology will fill the needs of high-performance systems well into the future, but printed wiring board (PWB) modules (MCM-L) can provide solutions now. The rationale for expanded use is discussed. MCM-L represents the most logical substrate technology for use in the current and next-generation personal computers, workstations, and communication equipment. The bulk of these systems will not need the routing density of MCM-D.<>