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Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92最新文献

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Electrical analysis of a thin film multichip module substrate 薄膜多芯片模块衬底的电性分析
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201468
W. Blood, Wai-Yeung Yip
{"title":"Electrical analysis of a thin film multichip module substrate","authors":"W. Blood, Wai-Yeung Yip","doi":"10.1109/MCMC.1992.201468","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201468","url":null,"abstract":"Several related technologies are required to design and manufacture a successful multichip module product. Technology selection depends on how certain parameters are weighted. Decision parameters include module size, number of input/output signals, performance, power, ambient temperature environment, availability of semiconductors other than wirebond-compatible, and cost. The authors describe the electrical analysis performed on a 6-chip evaluation module designed and built within Motorola. Results of the module electrical analysis are compared with estimates of the same circuit function built with single chip packages on a printed circuit board.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"109 2 Suppl 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130676078","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
On the study of skin-effect and dispersion of heavily lossy transmission lines 重损耗输电线路的趋肤效应和色散研究
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201447
G. Pan, X. Zhu, B. Wang, B. Gilbert
{"title":"On the study of skin-effect and dispersion of heavily lossy transmission lines","authors":"G. Pan, X. Zhu, B. Wang, B. Gilbert","doi":"10.1109/MCMC.1992.201447","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201447","url":null,"abstract":"A special case of a circular coaxial cable with heavy conduction loss was studied by full-wave analysis, and compared with the quasi-transverse electromagnetic (TEM) solutions. It was found that at high frequencies the tangential electrical fields will be much greater than the values reported in the literature. Despite relatively strong longitudinal E-fields and radial currents, the comparison revealed that, provided the circuit parameters are properly evaluated, the errors introduced by a simple distributed circuit model under the quasi-TEM assumption are not excessively large. Therefore, the telegraphist's equations may give good results up to frequencies of 10 GHz or higher for transmission lines of small geometries commonly found in microelectronics packaging. A second case of three coupled microstrips of rectangular cross-section was also analyzed and compared with network measurements. It was found that the dispersion occurring in microelectronics packaging interconnects at frequencies up to the microwave band is anomalous.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131228219","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Characteristics of thin-film devices for a stack-type MCM 堆叠型MCM薄膜器件的特性
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201474
S. Takahashi, Y. Hayashi, T. Kunio, N. Endo
{"title":"Characteristics of thin-film devices for a stack-type MCM","authors":"S. Takahashi, Y. Hayashi, T. Kunio, N. Endo","doi":"10.1109/MCMC.1992.201474","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201474","url":null,"abstract":"A stack-type multichip module (MCM) or CUBIC (cumulative bonded IC) is proposed. The CUBIC is composed of thin-film device layers that are only a few micrometers thick stacked vertically and connected electrically. It has short chip-to-chip interconnections and a small module size. The characteristics of the thin-film devices are reported as a function of polished silicon layer thickness.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122396762","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Rapid prototyping of multi-chip modules 多芯片模块的快速成型
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201475
R. Miracky, C. Galanakis, H. Hashemi, T. Hirsch, S. Madere, H. Muller, T. Rudwick, S. Sommerfeldt
{"title":"Rapid prototyping of multi-chip modules","authors":"R. Miracky, C. Galanakis, H. Hashemi, T. Hirsch, S. Madere, H. Muller, T. Rudwick, S. Sommerfeldt","doi":"10.1109/MCMC.1992.201475","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201475","url":null,"abstract":"The authors describe a rapid prototyping methodology for multichip modules, based upon laser processes for linking and cutting conductors. They discuss some of the design and test issues involved in this approach. Results are presented of efforts to independently demonstrate each component technology.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"120 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124691071","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Delay macromodels for point-to-point MCM interconnections 点对点MCM互连的延迟宏模型
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201452
A. I. Kayssi, K. Sakallah
{"title":"Delay macromodels for point-to-point MCM interconnections","authors":"A. I. Kayssi, K. Sakallah","doi":"10.1109/MCMC.1992.201452","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201452","url":null,"abstract":"Dimensional analysis is used to develop a macromodel for point-to-point multichip module (MCM) interconnect delay, which applies to lossless and lossy lines. The equation for lossless lines is linear and very simple; the equation for lossy lines is quadratic. In terms of computational costs, the evaluation of delay involves 24 multiplications, and is several orders of magnitude faster than using circuit simulation or transmission line analysis programs to calculate delays. Using the macromodel, the authors derived the dependence of delay on several technology parameters, and calculated the sensitivity of delay to the circuit parameters.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130871814","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
MCM and monolithic VLSI perspectives on dependencies, integration, performance and economics MCM和单片VLSI的依赖关系，集成，性能和经济观点
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201432
W. Siu
{"title":"MCM and monolithic VLSI perspectives on dependencies, integration, performance and economics","authors":"W. Siu","doi":"10.1109/MCMC.1992.201432","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201432","url":null,"abstract":"It is argued that multichip module (MCM) technologies, tools, and infrastructures are still lacking, while monolithic VLSIs have continued to progress for the past two decades, delivering greater functionality and higher performance at lower cost. The author offers perspectives on the performance and economics of MCMs and VLSIs. In particular, he examines the dependencies and contrasts the competitiveness between these two integration technologies. The analysis points to opportunities and action agendas for MCMs. It is concluded that the MCM is an important system integration technology that, if properly utilized, can provide significant added value. It should not be approached as a VLSI replacement. Rather, it should be used as an important adjunct to VLSIs.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"201 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121896293","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 20
A study on the feasibility of using MCMs: a designer's perspective 运用mcm的可行性研究:一个设计师的视角
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201465
R. Chew
{"title":"A study on the feasibility of using MCMs: a designer's perspective","authors":"R. Chew","doi":"10.1109/MCMC.1992.201465","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201465","url":null,"abstract":"The purpose of the multichip module (MCM) project discussed was to develop and test a moderately complex, high-performance MCM, and in doing so, to determine the feasibility and constraints of using this approach to high-density hybrid integration. The end product was to be a working MCM prototype that could be characterized and tested at speed. The project was divided into four phases: (1) vendor evaluation; (2) electrical design; (3) mechanical design; and (4) reevaluation. Each phase is described. This work led to the determination that MCMs are a viable technology when speed and real estate are design drivers. It was found that maintaining good communications with the vendor throughout the design cycle is important. The limitations on the design tools may require the use of multiple tools to verify the functionality and performance of an MCM.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"103 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129925518","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Yield and reliability concerns in polyimide based multi-chip modules 基于聚酰亚胺的多芯片模块的成品率和可靠性问题
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201457
V. Murali, T. Rucker, J. Fu, R. Shukla
{"title":"Yield and reliability concerns in polyimide based multi-chip modules","authors":"V. Murali, T. Rucker, J. Fu, R. Shukla","doi":"10.1109/MCMC.1992.201457","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201457","url":null,"abstract":"The key technology elements used in the fabrication of a high-performance, low-cost silicon-on-silicon multichip module (MCM) are described. Al/PI multilayer substrates, flip-chip soldering of chips to substrate, and wire bonding of substrate to a ceramic pin grid array (PGA) package were the various interconnection elements used. Some of the yield and reliability issues encountered in the manufacture of the substrates, the flip-chip process, and wire bonding of the Al/PI structures are discussed, and process changes made to solve some of these problems are presented.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123790233","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Applications of multichip modules for high speed communications interfaces 多芯片模块在高速通信接口中的应用
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201435
A. Kozak
{"title":"Applications of multichip modules for high speed communications interfaces","authors":"A. Kozak","doi":"10.1109/MCMC.1992.201435","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201435","url":null,"abstract":"The analysis of next generation broadband communication equipment shows that advanced packaging technology is required to meet system performance, thermal and density requirements. A description of a broadband crossconnect switching system is provided, and the use of multichip module technology to satisfy the system packaging requirements is reviewed. A module solution to one of the key elements of the system, a 622 Mbit/s fiber optic line interface, is described, and the overall impact on the system design is discussed.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128389124","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
High-density, array, optical interconnects for multi-chip modules 用于多芯片模块的高密度、阵列、光互连
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI: 10.1109/MCMC.1992.201469
K. Jackson
{"title":"High-density, array, optical interconnects for multi-chip modules","authors":"K. Jackson","doi":"10.1109/MCMC.1992.201469","DOIUrl":"https://doi.org/10.1109/MCMC.1992.201469","url":null,"abstract":"A compact, planar-processed package using flip-chip, self-aligned optoelectronic components is described. The optoelectronic module contains both a four-channel AlGaAs laser transmitter and a four-channel GaAs MESFET integrated detector/preamp receiver on a single substrate. The optical waveguides act as an optical bench which mechanically aligns the optoelectronic components, waveguides, and off-module fiber ribbon connector interface. Preliminary measurements have been carried out by operating the packaged receiver arrays with a commercially available reference laser source at a data rate of 1 Gb/s. Results are reported.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131688750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
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