Electrical analysis of a thin film multichip module substrate

Abstract

Several related technologies are required to design and manufacture a successful multichip module product. Technology selection depends on how certain parameters are weighted. Decision parameters include module size, number of input/output signals, performance, power, ambient temperature environment, availability of semiconductors other than wirebond-compatible, and cost. The authors describe the electrical analysis performed on a 6-chip evaluation module designed and built within Motorola. Results of the module electrical analysis are compared with estimates of the same circuit function built with single chip packages on a printed circuit board.<>