多芯片模块的快速成型

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI:10.1109/MCMC.1992.201475

R. Miracky, C. Galanakis, H. Hashemi, T. Hirsch, S. Madere, H. Muller, T. Rudwick, S. Sommerfeldt

{"title":"多芯片模块的快速成型","authors":"R. Miracky, C. Galanakis, H. Hashemi, T. Hirsch, S. Madere, H. Muller, T. Rudwick, S. Sommerfeldt","doi":"10.1109/MCMC.1992.201475","DOIUrl":null,"url":null,"abstract":"The authors describe a rapid prototyping methodology for multichip modules, based upon laser processes for linking and cutting conductors. They discuss some of the design and test issues involved in this approach. Results are presented of efforts to independently demonstrate each component technology.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"120 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Rapid prototyping of multi-chip modules\",\"authors\":\"R. Miracky, C. Galanakis, H. Hashemi, T. Hirsch, S. Madere, H. Muller, T. Rudwick, S. Sommerfeldt\",\"doi\":\"10.1109/MCMC.1992.201475\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The authors describe a rapid prototyping methodology for multichip modules, based upon laser processes for linking and cutting conductors. They discuss some of the design and test issues involved in this approach. Results are presented of efforts to independently demonstrate each component technology.<<ETX>>\",\"PeriodicalId\":202574,\"journal\":{\"name\":\"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92\",\"volume\":\"120 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-03-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1992.201475\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1992.201475","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

作者描述了一种基于连接和切割导体的激光工艺的多芯片模块快速原型制作方法。他们讨论了该方法中涉及的一些设计和测试问题。结果展示了独立演示每个组件技术的努力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Rapid prototyping of multi-chip modules

The authors describe a rapid prototyping methodology for multichip modules, based upon laser processes for linking and cutting conductors. They discuss some of the design and test issues involved in this approach. Results are presented of efforts to independently demonstrate each component technology.<>

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92

自引率

0.00%

发文量