Applications of multichip modules for high speed communications interfaces

Abstract

The analysis of next generation broadband communication equipment shows that advanced packaging technology is required to meet system performance, thermal and density requirements. A description of a broadband crossconnect switching system is provided, and the use of multichip module technology to satisfy the system packaging requirements is reviewed. A module solution to one of the key elements of the system, a 622 Mbit/s fiber optic line interface, is described, and the overall impact on the system design is discussed.<>