{"title":"薄膜多芯片模块衬底的电性分析","authors":"W. Blood, Wai-Yeung Yip","doi":"10.1109/MCMC.1992.201468","DOIUrl":null,"url":null,"abstract":"Several related technologies are required to design and manufacture a successful multichip module product. Technology selection depends on how certain parameters are weighted. Decision parameters include module size, number of input/output signals, performance, power, ambient temperature environment, availability of semiconductors other than wirebond-compatible, and cost. The authors describe the electrical analysis performed on a 6-chip evaluation module designed and built within Motorola. Results of the module electrical analysis are compared with estimates of the same circuit function built with single chip packages on a printed circuit board.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"109 2 Suppl 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Electrical analysis of a thin film multichip module substrate\",\"authors\":\"W. Blood, Wai-Yeung Yip\",\"doi\":\"10.1109/MCMC.1992.201468\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Several related technologies are required to design and manufacture a successful multichip module product. Technology selection depends on how certain parameters are weighted. Decision parameters include module size, number of input/output signals, performance, power, ambient temperature environment, availability of semiconductors other than wirebond-compatible, and cost. The authors describe the electrical analysis performed on a 6-chip evaluation module designed and built within Motorola. Results of the module electrical analysis are compared with estimates of the same circuit function built with single chip packages on a printed circuit board.<<ETX>>\",\"PeriodicalId\":202574,\"journal\":{\"name\":\"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92\",\"volume\":\"109 2 Suppl 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-03-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1992.201468\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1992.201468","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electrical analysis of a thin film multichip module substrate
Several related technologies are required to design and manufacture a successful multichip module product. Technology selection depends on how certain parameters are weighted. Decision parameters include module size, number of input/output signals, performance, power, ambient temperature environment, availability of semiconductors other than wirebond-compatible, and cost. The authors describe the electrical analysis performed on a 6-chip evaluation module designed and built within Motorola. Results of the module electrical analysis are compared with estimates of the same circuit function built with single chip packages on a printed circuit board.<>
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