Characteristics of thin-film devices for a stack-type MCM

Abstract

A stack-type multichip module (MCM) or CUBIC (cumulative bonded IC) is proposed. The CUBIC is composed of thin-film device layers that are only a few micrometers thick stacked vertically and connected electrically. It has short chip-to-chip interconnections and a small module size. The characteristics of the thin-film devices are reported as a function of polished silicon layer thickness.<>