{"title":"多芯片模块在高速通信接口中的应用","authors":"A. Kozak","doi":"10.1109/MCMC.1992.201435","DOIUrl":null,"url":null,"abstract":"The analysis of next generation broadband communication equipment shows that advanced packaging technology is required to meet system performance, thermal and density requirements. A description of a broadband crossconnect switching system is provided, and the use of multichip module technology to satisfy the system packaging requirements is reviewed. A module solution to one of the key elements of the system, a 622 Mbit/s fiber optic line interface, is described, and the overall impact on the system design is discussed.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Applications of multichip modules for high speed communications interfaces\",\"authors\":\"A. Kozak\",\"doi\":\"10.1109/MCMC.1992.201435\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The analysis of next generation broadband communication equipment shows that advanced packaging technology is required to meet system performance, thermal and density requirements. A description of a broadband crossconnect switching system is provided, and the use of multichip module technology to satisfy the system packaging requirements is reviewed. A module solution to one of the key elements of the system, a 622 Mbit/s fiber optic line interface, is described, and the overall impact on the system design is discussed.<<ETX>>\",\"PeriodicalId\":202574,\"journal\":{\"name\":\"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-03-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1992.201435\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1992.201435","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Applications of multichip modules for high speed communications interfaces
The analysis of next generation broadband communication equipment shows that advanced packaging technology is required to meet system performance, thermal and density requirements. A description of a broadband crossconnect switching system is provided, and the use of multichip module technology to satisfy the system packaging requirements is reviewed. A module solution to one of the key elements of the system, a 622 Mbit/s fiber optic line interface, is described, and the overall impact on the system design is discussed.<>
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