堆叠型MCM薄膜器件的特性

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI:10.1109/MCMC.1992.201474

S. Takahashi, Y. Hayashi, T. Kunio, N. Endo

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引用次数: 7

摘要

提出了一种堆叠型多芯片模块(MCM)或CUBIC (cumulative bonding IC)。CUBIC由只有几微米厚的薄膜器件层垂直堆叠并电连接而成。它具有短芯片到芯片的互连和一个小的模块尺寸。薄膜器件的特性是抛光硅层厚度的函数。

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Characteristics of thin-film devices for a stack-type MCM

A stack-type multichip module (MCM) or CUBIC (cumulative bonded IC) is proposed. The CUBIC is composed of thin-film device layers that are only a few micrometers thick stacked vertically and connected electrically. It has short chip-to-chip interconnections and a small module size. The characteristics of the thin-film devices are reported as a function of polished silicon layer thickness.<>

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Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92

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