Simulation and optimization of interconnect delay and crosstalk in multi-chip modules

M. Nakhla, Q. Zhang
{"title":"Simulation and optimization of interconnect delay and crosstalk in multi-chip modules","authors":"M. Nakhla, Q. Zhang","doi":"10.1109/MCMC.1992.201446","DOIUrl":null,"url":null,"abstract":"As signal speeds increase, interconnect effects such as delay, distortion and crosstalk become the dominant factor limiting the overall performance of a multichip module. The authors outline efficient techniques recently developed for addressing three specific aspects of the high-speed interconnect problem, namely, simulation, sensitivity analysis and performance optimization. These techniques accommodate distributed interconnect models represented by lossy coupled transmission lines. Two examples showing the applications of these techniques are included.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1992.201446","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

As signal speeds increase, interconnect effects such as delay, distortion and crosstalk become the dominant factor limiting the overall performance of a multichip module. The authors outline efficient techniques recently developed for addressing three specific aspects of the high-speed interconnect problem, namely, simulation, sensitivity analysis and performance optimization. These techniques accommodate distributed interconnect models represented by lossy coupled transmission lines. Two examples showing the applications of these techniques are included.<>
多芯片模块互连延迟和串扰的仿真与优化
随着信号速度的提高,延迟、失真和串扰等互连效应成为限制多芯片模块整体性能的主要因素。作者概述了最近为解决高速互连问题的三个具体方面而开发的有效技术,即仿真,灵敏度分析和性能优化。这些技术适应以损耗耦合传输线为代表的分布式互连模型。本文提供了两个示例,展示了这些技术的应用
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