多芯片模块电气性能分析的集成方法

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 Pub Date : 1992-03-18 DOI:10.1109/MCMC.1992.201455

J. Liao, G.N. Choksi

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引用次数: 3

摘要

作者描述了一种综合的方法来评估多芯片模块的电气性能。开发了一个由建模和仿真工具组成的软件系统，用于从放置和布线系统中提取几何形状，计算电寄生，并创建等效电路文件以执行电路仿真。利用该工具设计了一个基于i486微处理器的多芯片模块。给出了典型的分析结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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An integrated approach for electrical performance analysis of multichip modules

The authors describe an integrated approach to evaluate the electrical performance of multichip modules. A software system consisting of modeling and simulation tools to extract geometry from a placement and routing system, compute electrical parasiticsm, and create equivalent circuit files to perform circuit simulations has been developed. This tool was used in designing an i486 microprocessor-based multichip module. Typical results from the analysis are presented.<>

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Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92

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