Silicon-on-silicon technology for CMOS-based computer systems

Abstract

The main features of Si-on-Si technology are outlined. The electrical design of the wiring substrate is described, and chip connection and thermal design issues are addressed. Several options for mechanically supporting a large Si substrate are considered. A digital signal processing module developed using chip-on-wafer technology is discussed as an example. AlN ceramic was found to be an excellent packaging material to mechanically support a large Si substrate with high reliability.<>