2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers最新文献

筛选
英文 中文
High-performance MoS2 field-effect transistors enabled by chloride doping: Record low contact resistance (0.5 kΩ·µm) and record high drain current (460 µA/µm) 氯化物掺杂实现高性能MoS2场效应晶体管:创纪录的低接触电阻(0.5 kΩ·µm)和创纪录的高漏极电流(460µA/µm)
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers Pub Date : 2014-06-09 DOI: 10.1109/VLSIT.2014.6894432
Lingming Yang, K. Majumdar, Yuchen Du, Han Liu, Heng Wu, M. Hatzistergos, P. Hung, R. Tieckelmann, W. Tsai, C. Hobbs, P. Ye
{"title":"High-performance MoS2 field-effect transistors enabled by chloride doping: Record low contact resistance (0.5 kΩ·µm) and record high drain current (460 µA/µm)","authors":"Lingming Yang, K. Majumdar, Yuchen Du, Han Liu, Heng Wu, M. Hatzistergos, P. Hung, R. Tieckelmann, W. Tsai, C. Hobbs, P. Ye","doi":"10.1109/VLSIT.2014.6894432","DOIUrl":"https://doi.org/10.1109/VLSIT.2014.6894432","url":null,"abstract":"In this paper, we report a novel chemical doping technique to reduce the contact resistance (R<sub>c</sub>) of transition metal dichalcogenides (TMDs) - eliminating two major roadblocks (namely, doping and high R<sub>c</sub>) towards demonstration of high-performance TMDs field-effect transistors (FETs). By using 1,2 dichloroethane (DCE) as the doping reagent, we demonstrate an active n-type doping density > 2×10<sup>19</sup> cm<sup>-3</sup> in a few-layer MoS<sub>2</sub> film. This enabled us to reduce the R<sub>c</sub> value to a record low number of 0.5 kΩ·μm, which is ~10×lower than the control sample without doping. The corresponding specific contact resistivity (ρ<sub>c</sub>) is found to decrease by two orders of magnitude. With such low R<sub>c</sub>, we demonstrate 100 nm channel length (L<sub>ch</sub>) MoS<sub>2</sub> FET with a drain current (I<sub>ds</sub>) of 460 μA/μm at V<sub>ds</sub> = 1.6 V, which is twice the best value reported so far on MoS<sub>2</sub> FETs.","PeriodicalId":105807,"journal":{"name":"2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134255862","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 54
Strained Si1−xGex-on-insulator PMOS FinFETs with excellent sub-threshold leakage, extremely-high short-channel performance and source injection velocity for 10nm node and beyond 应变Si1−xGex-on-insulator PMOS finfet具有优异的亚阈值泄漏,极高的短通道性能和10nm及以上节点的源注入速度
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers Pub Date : 2014-06-09 DOI: 10.1109/VLSIT.2014.6894344
P. Hashemi, K. Balakrishnan, A. Majumdar, A. Khakifirooz, Wanki Kim, A. Baraskar, L. Yang, Kevin K. H. Chan, S. Engelmann, J. Ott, D. Antoniadis, E. Leobandung, Dae-gyu Park
{"title":"Strained Si1−xGex-on-insulator PMOS FinFETs with excellent sub-threshold leakage, extremely-high short-channel performance and source injection velocity for 10nm node and beyond","authors":"P. Hashemi, K. Balakrishnan, A. Majumdar, A. Khakifirooz, Wanki Kim, A. Baraskar, L. Yang, Kevin K. H. Chan, S. Engelmann, J. Ott, D. Antoniadis, E. Leobandung, Dae-gyu Park","doi":"10.1109/VLSIT.2014.6894344","DOIUrl":"https://doi.org/10.1109/VLSIT.2014.6894344","url":null,"abstract":"We demonstrate high performance (HP) s-SiGe pMOS finFETs with I<sub>on</sub>/I<sub>eff</sub> of ~1.05/0.52mA/μm and ~1.3/0.71mA/μm at I<sub>off</sub>=100nA/μm at V<sub>DD</sub>=0.8 and 1V, extremely high intrinsic performance and source injection velocity. Compared to earlier work, an optimized process flow and a novel interface passivation scheme, result in ~30% mobility enhancement and dramatic sub-threshold-swing reduction to 65mV/dec. We also demonstrate the most aggressively scaled s-SiGe finFET reported to date, with W<sub>FIN</sub>~8nm and L<sub>G</sub>~15nm, while maintaining high current drive and low leakage. With their very low GIDL-limited I<sub>D, min</sub> and more manufacturing-friendly process compared to high-Ge content SiGe devices, as well as impressive I<sub>on</sub>~0.42mA/μm at I<sub>off</sub> =100nA/μm and g<sub>m, int</sub> as high as 2.4mS/μm at V<sub>DD</sub>=0.5V, s-SiGe finFETs are strong candidates for future HP and low-power applications.","PeriodicalId":105807,"journal":{"name":"2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers","volume":"254 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134495761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Direct measurement of the dynamic variability of 0.120µm2 SRAM cells in 28nm FD-SOI technology 采用28nm FD-SOI技术直接测量0.120µm2 SRAM细胞的动态变异性
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers Pub Date : 2014-06-09 DOI: 10.1109/VLSIT.2014.6894415
J. El Husseini, X. Garros, A. Subirats, A. Makosiej, O. Weber, O. Thomas, V. Huard, X. Federspiel, G. Reimbold
{"title":"Direct measurement of the dynamic variability of 0.120µm2 SRAM cells in 28nm FD-SOI technology","authors":"J. El Husseini, X. Garros, A. Subirats, A. Makosiej, O. Weber, O. Thomas, V. Huard, X. Federspiel, G. Reimbold","doi":"10.1109/VLSIT.2014.6894415","DOIUrl":"https://doi.org/10.1109/VLSIT.2014.6894415","url":null,"abstract":"Dynamic variability of 28nm FD-SOI high density SRAMs has been directly measured and carefully modeled using a new technique based on the Supply Read Retention Voltage (SRRV) metric. It is proven that, for this technology, N&PBTI induced variability has only a small impact on the SRAM read stability after 10 years working at operating conditions.","PeriodicalId":105807,"journal":{"name":"2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers","volume":"99 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124555219","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A fast and low-voltage Cu complementary-atom-switch 1Mb array with high-temperature retention 一种具有高温保持的快速低压铜互补原子开关1Mb阵列
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers Pub Date : 2014-06-09 DOI: 10.1109/VLSIT.2014.6894437
N. Banno, M. Tada, T. Sakamoto, M. Miyamura, K. Okamoto, N. Iguchi, T. Nohisa, H. Hada
{"title":"A fast and low-voltage Cu complementary-atom-switch 1Mb array with high-temperature retention","authors":"N. Banno, M. Tada, T. Sakamoto, M. Miyamura, K. Okamoto, N. Iguchi, T. Nohisa, H. Hada","doi":"10.1109/VLSIT.2014.6894437","DOIUrl":"https://doi.org/10.1109/VLSIT.2014.6894437","url":null,"abstract":"Fast (10ns) and low voltage (2V) programming of Cu atom switch has been demonstrated in a 1Mb switch array for the first time. A newly developed redox-control buffer of Al<sub>0.5</sub>Ti<sub>0.5</sub>O<sub>x</sub> leads to extremely steep slope switching of voltage dependent time-to-ON-state (56mV/decade), by eliminating metallic Al residues at the Cu surface. The programmed ON-state shows long lifetimes both under data-retention test at 260°C and DC stress test (I<sub>max</sub>=140μA) at 125°C. A redox-control technology is indispensable for conducting bridges used in a low-power, nonvolatile programmable logic (NPL).","PeriodicalId":105807,"journal":{"name":"2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers","volume":"187 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128186714","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
A novel capacitive-coupled floating gate antenna protection design and its application to prevent in-process charging effects for 3D NAND flash memory 一种新型电容耦合浮栅天线保护设计及其在3D NAND闪存中防止过程中充电效应的应用
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers Pub Date : 2014-06-09 DOI: 10.1109/VLSIT.2014.6894400
H. Lue, T. Yeh, Kuo-Ping Chang, T. Hsu, Y. Shih, Chih-Yuan Lu
{"title":"A novel capacitive-coupled floating gate antenna protection design and its application to prevent in-process charging effects for 3D NAND flash memory","authors":"H. Lue, T. Yeh, Kuo-Ping Chang, T. Hsu, Y. Shih, Chih-Yuan Lu","doi":"10.1109/VLSIT.2014.6894400","DOIUrl":"https://doi.org/10.1109/VLSIT.2014.6894400","url":null,"abstract":"In-process charging effect is found to deteriorate the initial Vt distribution of 3D NAND Flash. In this work, we propose a novel antenna protection circuit using a capacitive coupled floating gate (CCFG) CMOS circuit that can be applied to the word line (WL), string select (SSL) and ground select transistor (GSL) decoders. Experimental results show a very low turn-on voltage (<; +/-2V) for discharging, providing ideal protection for the memory devices. With this novel technique, our fully-integrated 3D NAND Flash device shows excellent initial Vt distribution free from the charging effect. Furthermore, the impact of SSL Vt distribution on the minimal Vdd bias is studied. With optimal SSL Vt distribution, it is demonstrated that 3D VG NAND Flash can support Vdd as low as 1.6V with successful programming window.","PeriodicalId":105807,"journal":{"name":"2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129031165","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Electrical and reliability characteristics of a scaled (∼30nm) tunnel barrier selector (W/Ta2O5/TaOx/TiO2/TiN) with excellent performance (JMAX > 107A/cm2) 具有优异性能(JMAX > 107A/cm2)的尺寸(~ 30nm)隧道势垒选择器(W/Ta2O5/TaOx/TiO2/TiN)的电气特性和可靠性
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers Pub Date : 2014-06-09 DOI: 10.1109/VLSIT.2014.6894431
J. Woo, Jeonghwan Song, Kibong Moon, Ji Hyun Lee, E. Cha, A. Prakash, Daeseok Lee, Sangheon Lee, Jaesung Park, Y. Koo, Chan Gyung Park, H. Hwang
{"title":"Electrical and reliability characteristics of a scaled (∼30nm) tunnel barrier selector (W/Ta2O5/TaOx/TiO2/TiN) with excellent performance (JMAX > 107A/cm2)","authors":"J. Woo, Jeonghwan Song, Kibong Moon, Ji Hyun Lee, E. Cha, A. Prakash, Daeseok Lee, Sangheon Lee, Jaesung Park, Y. Koo, Chan Gyung Park, H. Hwang","doi":"10.1109/VLSIT.2014.6894431","DOIUrl":"https://doi.org/10.1109/VLSIT.2014.6894431","url":null,"abstract":"We demonstrate a selector device with excellent performances (J<sub>MAX</sub> > 10<sup>7</sup>A/cm<sup>2</sup>, switching speed <; 20ns) at the 30nm cell size. Furthermore, these promising device characteristics were achieved in a fully CMOS compatible stack (W/Ta<sub>2</sub>O<sub>5</sub>/TaO<sub>x</sub>/TiO<sub>2</sub>/TiN) with extremely thin oxide layer (<; 10nm). Through the comprehensive understanding on the exponential I-V curve, the effect of intrinsic/extrinsic factors such as scaling (area and thickness), and parasitic components were systemically investigated.","PeriodicalId":105807,"journal":{"name":"2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123010161","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 17
Demonstration of Ge pMOSFETs with 6 Å EOT using TaN/ZrO2/Zr-cap/n-Ge(100) gate stack fabricated by novel vacuum annealing and in-situ metal capping method 采用新型真空退火和原位金属封盖法制备TaN/ZrO2/Zr-cap/n-Ge(100)栅极堆制备6 Å EOT Ge pmosfet
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers Pub Date : 2014-06-09 DOI: 10.1109/VLSIT.2014.6894377
Yunsang Shin, W. Chung, Yujin Seo, Choong-Ho Lee, D. Sohn, B. Cho
{"title":"Demonstration of Ge pMOSFETs with 6 Å EOT using TaN/ZrO2/Zr-cap/n-Ge(100) gate stack fabricated by novel vacuum annealing and in-situ metal capping method","authors":"Yunsang Shin, W. Chung, Yujin Seo, Choong-Ho Lee, D. Sohn, B. Cho","doi":"10.1109/VLSIT.2014.6894377","DOIUrl":"https://doi.org/10.1109/VLSIT.2014.6894377","url":null,"abstract":"The superior gate stack was fabricated by employing novel high vacuum annealing followed by in-situ metal capping method to suppress GeO<sub>x</sub> regrowth. Less GeO volatilization induces less Ta diffusion into gate oxide which reduces leakage current and enables further scaling. With ZrO<sub>2</sub>/Zr-cap stack, highly scaled Ge (100) pMOSFETs have been demonstrated which shows extremely low EOT (6.06 Å), low gate leakage current of 250 nA/cm<sup>2</sup>@|V<sub>g</sub>-V<sub>FB</sub>|=1V, superior SS of 70 mV/dec, and 110 cm<sup>2</sup>/Vs of peak hole mobility.","PeriodicalId":105807,"journal":{"name":"2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126616670","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Analog, RF, and ESD device challenges and solutions for 14nm FinFET technology and beyond 模拟,射频和ESD器件的挑战和解决方案,为14nm FinFET技术和超越
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers Pub Date : 2014-06-09 DOI: 10.1109/VLSIT.2014.6894378
Jagar Singh, C. Jerome, A. Wei, R. Miller, B. Arnaud, Cheng Lili, H. Zang, Punchihewa Kasun, Prabhu Manjunatha, Senapati Biswanath, Anil Kumar, S. Pandey, N. M. Iyer, Anurag Mittal, R. Carter, Lun Zhao, E. Manfred, S. Samavedam
{"title":"Analog, RF, and ESD device challenges and solutions for 14nm FinFET technology and beyond","authors":"Jagar Singh, C. Jerome, A. Wei, R. Miller, B. Arnaud, Cheng Lili, H. Zang, Punchihewa Kasun, Prabhu Manjunatha, Senapati Biswanath, Anil Kumar, S. Pandey, N. M. Iyer, Anurag Mittal, R. Carter, Lun Zhao, E. Manfred, S. Samavedam","doi":"10.1109/VLSIT.2014.6894378","DOIUrl":"https://doi.org/10.1109/VLSIT.2014.6894378","url":null,"abstract":"Fin-based analog, passive, RF and ESD devices have serious performance challenges, such as poor ideality, higher leakage, low breakdown voltage (BV) of diodes, BJTs with poor ideality, mismatch, weak re-surf action and low drain current(Id/μm) of Laterally diffused MOS (LDMOS), degraded RF and 1/f noise of analog CMOS, etc. Innovative solutions which maintain process simplicity and low cost are described in this paper. These new device designs demonstrate excellent performance, such as near perfect-ideality(η)≈1.01 diodes, low leakage, high BV, and BJTs with excellent analog behavior. Fin-based LDMOS and ESD devices outperform conventional planar devices in terms of Id/μm and ESD human body model (HBM) performance, respectively.","PeriodicalId":105807,"journal":{"name":"2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers","volume":"100 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121750115","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Lowest variability SOI FinFETs having multiple Vt by back-biasing 通过反向偏置具有多个Vt的最低可变性SOI finfet
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers Pub Date : 2014-06-09 DOI: 10.1109/VLSIT.2014.6894393
T. Matsukawa, K. Fukuda, Y. Liu, K. Endo, J. Tsukada, H. Yamauchi, Y. Ishikawa, S. O'Uchi, W. Mizubayashi, S. Migita, Y. Morita, H. Ota, M. Masahara
{"title":"Lowest variability SOI FinFETs having multiple Vt by back-biasing","authors":"T. Matsukawa, K. Fukuda, Y. Liu, K. Endo, J. Tsukada, H. Yamauchi, Y. Ishikawa, S. O'Uchi, W. Mizubayashi, S. Migita, Y. Morita, H. Ota, M. Masahara","doi":"10.1109/VLSIT.2014.6894393","DOIUrl":"https://doi.org/10.1109/VLSIT.2014.6894393","url":null,"abstract":"FinFETs with an amorphous metal gate (MG) are fabricated on silicon-on-thin-buried-oxide (SOTB) wafers for realizing both low variability and tunable threshold voltage (V<sub>t</sub>) necessary for multiple V<sub>t</sub> solution. The FinFETs with an amorphous TaSiN MG record the lowest on-state drain current (I<sub>on</sub>) variability (0.37 %μm) in comparison to bulk and SOI planar MOSFETs thanks to the suppressed variability of V<sub>t</sub> (A<sub>Vt</sub>=1.32 mVμm), drain induced barrier lowering (DIBL) and trans-conductance (G<sub>m</sub>). Back-biasing through the SOTB provides excellent V<sub>t</sub> controllability keeping the low V<sub>t</sub> variability in contrast to V<sub>t</sub> tuning by fin channel doping.","PeriodicalId":105807,"journal":{"name":"2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121636455","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
NbO2-based low power and cost effective 1S1R switching for high density cross point ReRAM Application 基于nbo2的低功耗和低成本的1S1R开关用于高密度交叉点ReRAM应用
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers Pub Date : 2014-06-09 DOI: 10.1109/VLSIT.2014.6894405
W. Kim, Hyun Min Lee, B. Kim, Kyooho Jung, T. Seong, S. Kim, H. C. Jung, H. Kim, Jong-Hee Yoo, H. Lee, S. Kim, Suock Chung, Kee-jeung Lee, Jung Hoon Lee, H. Kim, S. Lee, Jianhua Yang, Yoocharn Jeon, R. S. Williams
{"title":"NbO2-based low power and cost effective 1S1R switching for high density cross point ReRAM Application","authors":"W. Kim, Hyun Min Lee, B. Kim, Kyooho Jung, T. Seong, S. Kim, H. C. Jung, H. Kim, Jong-Hee Yoo, H. Lee, S. Kim, Suock Chung, Kee-jeung Lee, Jung Hoon Lee, H. Kim, S. Lee, Jianhua Yang, Yoocharn Jeon, R. S. Williams","doi":"10.1109/VLSIT.2014.6894405","DOIUrl":"https://doi.org/10.1109/VLSIT.2014.6894405","url":null,"abstract":"In this paper, 5Xnm cross point cell array for the low power ReRAM operation was developed with 1S1R cell structure. Through the optimization of both TiOx/TaOx based-1R and NbO2 based-1S stacks with TiN based-electrode, the world's first and best bipolar switching characteristics with the lowest operation current (20~50uA) and sneak current (~1uA) level were acquired.","PeriodicalId":105807,"journal":{"name":"2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115100252","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 37
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信