发布求助
文献互助 智能选刊 最新文献

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)最新文献

筛选
英文 中文
LNOI photonics fabricated on Si wafer by room temperature bonding 室温键合在硅片上制备LNOI光子学
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI: 10.1109/LTB-3D53950.2021.9598368
Kaname Watanabe, Yuya Yamaguchi, A. Kanno, R. Takigawa
{"title":"LNOI photonics fabricated on Si wafer by room temperature bonding","authors":"Kaname Watanabe, Yuya Yamaguchi, A. Kanno, R. Takigawa","doi":"10.1109/LTB-3D53950.2021.9598368","DOIUrl":"https://doi.org/10.1109/LTB-3D53950.2021.9598368","url":null,"abstract":"Room temperature bonding is essential for wafer-level heterogeneous integration of LiNbO3-on-insulator (LNOI) photonics to Si. This paper reports first demonstration of thin film LNOI optical modulator arrays fabricated on Si wafer by room-temperature wafer bonding with Si nanoadhesive layer.","PeriodicalId":198318,"journal":{"name":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116970184","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Upconversion Material-Mediated Semiconductor Bonding 上转换材料介导半导体键合
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI: 10.1109/LTB-3D53950.2021.9598362
N. Sano, Kosuke Nishigaya, K. Tanabe
{"title":"Upconversion Material-Mediated Semiconductor Bonding","authors":"N. Sano, Kosuke Nishigaya, K. Tanabe","doi":"10.1109/LTB-3D53950.2021.9598362","DOIUrl":"https://doi.org/10.1109/LTB-3D53950.2021.9598362","url":null,"abstract":"Semiconductor wafer bonding, mediated by upconversion materials, is proposed and demonstrated. Upconversion is a process that converts long wavelength light into short wavelength light, and is expected to be applied to a variety of optoelectronic devices. Bonding with high electrical conductivity and imparting optical properties to the interface is realized by utilizing an adhesive viscous organic matrix with embedded upcinversiion nanoparticles. The application of this method to multijunction solar cells is expected.","PeriodicalId":198318,"journal":{"name":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128757339","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Reproduction Analysis of Fatigue Crack Networks in Sn-Ag-Cu Die Attach Joint by FEA Sn-Ag-Cu模具连接接头疲劳裂纹网络的有限元再现分析
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI: 10.1109/LTB-3D53950.2021.9598392
Hiroki Kanai, Y. Kariya, Yoshiki Abe, Y. Yokoyama, Koki Ochi, Ryuichiro Hanada, S. Izuo
{"title":"Reproduction Analysis of Fatigue Crack Networks in Sn-Ag-Cu Die Attach Joint by FEA","authors":"Hiroki Kanai, Y. Kariya, Yoshiki Abe, Y. Yokoyama, Koki Ochi, Ryuichiro Hanada, S. Izuo","doi":"10.1109/LTB-3D53950.2021.9598392","DOIUrl":"https://doi.org/10.1109/LTB-3D53950.2021.9598392","url":null,"abstract":"The formation process of fatigue crack networks in Sn-Ag-Cu die attach joint was experimentally observed, and reproduced by the Finite Element method Analysis (FEA) based on a crack initiation rule described by the logistic function and Paris type fatigue crack propagation law.","PeriodicalId":198318,"journal":{"name":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131946308","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Improved Process for Room-temperature Bonding Multiple GaAs Thin Plates to Develop Wavelength-conversion Devices 改进的室温多砷化镓薄板键合工艺以开发波长转换器件
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI: 10.1109/LTB-3D53950.2021.9598399
Yuki Takahashi, Chokutaro Kawai, I. Shoji
{"title":"Improved Process for Room-temperature Bonding Multiple GaAs Thin Plates to Develop Wavelength-conversion Devices","authors":"Yuki Takahashi, Chokutaro Kawai, I. Shoji","doi":"10.1109/LTB-3D53950.2021.9598399","DOIUrl":"https://doi.org/10.1109/LTB-3D53950.2021.9598399","url":null,"abstract":"Improved fabrication process enables us to reduce the internal scattering loss of a quasi-phase-matching (QPM) stack of multiple GaAs thin plates. This is accomplished by setting GaAs plates on YAG crystals with laser-grade flat surfaces. The loss per interface (at 1.5 μm) of the fabricated 25-plate stacked GaAs QPM device is 1.8 %, which is 70 % smaller than the 11-plate stack fabricated with the previous process.","PeriodicalId":198318,"journal":{"name":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126345057","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Towards Hybrid Optical Components via Non-Planar Direct Bonding 基于非平面直接键合的混合光学元件
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI: 10.1109/LTB-3D53950.2021.9598402
P. Birckigt, C. Rothhardt, S. Risse, U. Zeitner
{"title":"Towards Hybrid Optical Components via Non-Planar Direct Bonding","authors":"P. Birckigt, C. Rothhardt, S. Risse, U. Zeitner","doi":"10.1109/LTB-3D53950.2021.9598402","DOIUrl":"https://doi.org/10.1109/LTB-3D53950.2021.9598402","url":null,"abstract":"Here, we tackle the paradigm that direct bonding of planar wafers is not suitable on non-planar substrates. In doing so, we also present a new method for measuring the interface surface energy. This yields first guidelines for manufacturing novel optical components which combine different optical properties.","PeriodicalId":198318,"journal":{"name":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126435380","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Sputtering Technique to Fabricate Smooth Surface Oxide Film for Room Temperature Bonding 制备表面光滑氧化膜的溅射技术
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI: 10.1109/LTB-3D53950.2021.9598432
T. Saito, T. Hanasaki, T. Moriwaki, T. Goto, A. Takeda, A. Miura, M. Uomoto, T. Shimatsu
{"title":"Sputtering Technique to Fabricate Smooth Surface Oxide Film for Room Temperature Bonding","authors":"T. Saito, T. Hanasaki, T. Moriwaki, T. Goto, A. Takeda, A. Miura, M. Uomoto, T. Shimatsu","doi":"10.1109/LTB-3D53950.2021.9598432","DOIUrl":"https://doi.org/10.1109/LTB-3D53950.2021.9598432","url":null,"abstract":"200-nm-thick SiO<inf>2</inf> films were deposited on Si wafers using a bias sputtering apparatus with dual cathodes controlled by a plasma-balanced-system (PLABAS). Surface roughness S<inf>a</inf> of SiO<inf>2</inf> deposited films was extremely small: 0.10 nm. Bonding using the smooth surface was demonstrated.","PeriodicalId":198318,"journal":{"name":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121644792","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High Luminous Light-Emitting Diodes for Automotive Headlamps Fabricated Using Surface Activated Bonding 用表面活化键合制造汽车前照灯用高亮度发光二极管
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI: 10.1109/LTB-3D53950.2021.9598375
M. Ichikawa, S. Shichijo, H. Sagawa, S. Bando, Y. Nishioka, D. Wakamatsu, M. Sano, I. Nii, T. Mukai
{"title":"High Luminous Light-Emitting Diodes for Automotive Headlamps Fabricated Using Surface Activated Bonding","authors":"M. Ichikawa, S. Shichijo, H. Sagawa, S. Bando, Y. Nishioka, D. Wakamatsu, M. Sano, I. Nii, T. Mukai","doi":"10.1109/LTB-3D53950.2021.9598375","DOIUrl":"https://doi.org/10.1109/LTB-3D53950.2021.9598375","url":null,"abstract":"The luminous flux and temperature characteristics of InGaN-based white light-emitting diodes (LEDs) intended for automotive headlamps were greatly enhanced by bonding a yellow phosphor to the LED chip using surface activated bonding. The performance of these LEDs was found to be suitable for use as headlamps.","PeriodicalId":198318,"journal":{"name":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129731231","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Delamination Analysis of Stacked Via in High-Density Multilayer Printed Wiring Boards by FEA 高密度多层印刷线路板堆叠通孔分层分析
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI: 10.1109/LTB-3D53950.2021.9598404
Moe Nozaki, Y. Kariya, Yoshiyuki Hiroshima, Nobuo Taketomi, K. Ohashi, Kenichi Tomioka, Shunichi Kikuchi, Jack Tan
{"title":"Delamination Analysis of Stacked Via in High-Density Multilayer Printed Wiring Boards by FEA","authors":"Moe Nozaki, Y. Kariya, Yoshiyuki Hiroshima, Nobuo Taketomi, K. Ohashi, Kenichi Tomioka, Shunichi Kikuchi, Jack Tan","doi":"10.1109/LTB-3D53950.2021.9598404","DOIUrl":"https://doi.org/10.1109/LTB-3D53950.2021.9598404","url":null,"abstract":"The effects of structural factors on the delamination of the stacked via in high-density multilayer printed wiring boards were investigated by a statistical approach. Although reducing the height of via or the number of via stacks is effective to prevent the delamination, if these cannot be reduced, the risk of the delamination is eased by increasing the pitch of the stacked via.","PeriodicalId":198318,"journal":{"name":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128470158","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Tailor-made Laser Chip by Bonding for High Energy Laser System 基于键合的高能激光系统定制激光芯片
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI: 10.1109/LTB-3D53950.2021.9598355
A. Kausas, V. Yahia, A. Tsuji, Rui Zhang, Xiangyu Zhou, Y. Honda, M. Yoshida, T. Taira
{"title":"Tailor-made Laser Chip by Bonding for High Energy Laser System","authors":"A. Kausas, V. Yahia, A. Tsuji, Rui Zhang, Xiangyu Zhou, Y. Honda, M. Yoshida, T. Taira","doi":"10.1109/LTB-3D53950.2021.9598355","DOIUrl":"https://doi.org/10.1109/LTB-3D53950.2021.9598355","url":null,"abstract":"Multi-stack chips comprised of sapphire and Nd3+:YAG crystals with variable doping concentration were made by surface activated bonding technology. By use of sophisticated amplification setup for end-pumped solid-state laser, >2J operation with nanosecond pulses was obtained under room temperature.","PeriodicalId":198318,"journal":{"name":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127776501","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Fabrication of GaN/SiC/diamond structure for efficient thermal management of power device 功率器件高效热管理GaN/SiC/金刚石结构的制备
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI: 10.1109/LTB-3D53950.2021.9598453
R. Kagawa, K. Kawamura, Y. Sakaida, Sumito Ouchi, Hiroki Uratani, Y. Shimizu, Y. Ohno, Y. Nagai, N. Shigekawa, Jianbo Liang
{"title":"Fabrication of GaN/SiC/diamond structure for efficient thermal management of power device","authors":"R. Kagawa, K. Kawamura, Y. Sakaida, Sumito Ouchi, Hiroki Uratani, Y. Shimizu, Y. Ohno, Y. Nagai, N. Shigekawa, Jianbo Liang","doi":"10.1109/LTB-3D53950.2021.9598453","DOIUrl":"https://doi.org/10.1109/LTB-3D53950.2021.9598453","url":null,"abstract":"The self-heating of GaN-HEMTs is a serious issue in terms of the device performance and reliability. Therefore, diamond is the most promising candidate as a heat spreader material for HEMTs application because of its extremely high thermal conductivity. Therefore, we fabricate GaN-HEMTs on diamond substrate by using surface activated bonding method.","PeriodicalId":198318,"journal":{"name":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121894574","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
首页 上一页 下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信