High Luminous Light-Emitting Diodes for Automotive Headlamps Fabricated Using Surface Activated Bonding

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI:10.1109/LTB-3D53950.2021.9598375

M. Ichikawa, S. Shichijo, H. Sagawa, S. Bando, Y. Nishioka, D. Wakamatsu, M. Sano, I. Nii, T. Mukai

引用次数: 0

Abstract

The luminous flux and temperature characteristics of InGaN-based white light-emitting diodes (LEDs) intended for automotive headlamps were greatly enhanced by bonding a yellow phosphor to the LED chip using surface activated bonding. The performance of these LEDs was found to be suitable for use as headlamps.

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用表面活化键合制造汽车前照灯用高亮度发光二极管

采用表面激活键合的方法将黄色荧光粉粘接到LED芯片上，大大提高了用于汽车前照灯的ingan基白光发光二极管(LED)的光通量和温度特性。这些led的性能被发现适合用作头灯。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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