基于键合的高能激光系统定制激光芯片

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI:10.1109/LTB-3D53950.2021.9598355

A. Kausas, V. Yahia, A. Tsuji, Rui Zhang, Xiangyu Zhou, Y. Honda, M. Yoshida, T. Taira

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引用次数: 0

摘要

采用表面活化键合技术制备了由蓝宝石和不同掺杂浓度的Nd3+:YAG晶体组成的多层芯片。利用精密的端泵浦固体激光器放大装置，在室温下获得了大于2J的纳秒脉冲输出。

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Tailor-made Laser Chip by Bonding for High Energy Laser System

Multi-stack chips comprised of sapphire and Nd3+:YAG crystals with variable doping concentration were made by surface activated bonding technology. By use of sophisticated amplification setup for end-pumped solid-state laser, >2J operation with nanosecond pulses was obtained under room temperature.

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来源期刊

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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