室温键合在硅片上制备LNOI光子学

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI:10.1109/LTB-3D53950.2021.9598368

Kaname Watanabe, Yuya Yamaguchi, A. Kanno, R. Takigawa

{"title":"室温键合在硅片上制备LNOI光子学","authors":"Kaname Watanabe, Yuya Yamaguchi, A. Kanno, R. Takigawa","doi":"10.1109/LTB-3D53950.2021.9598368","DOIUrl":null,"url":null,"abstract":"Room temperature bonding is essential for wafer-level heterogeneous integration of LiNbO3-on-insulator (LNOI) photonics to Si. This paper reports first demonstration of thin film LNOI optical modulator arrays fabricated on Si wafer by room-temperature wafer bonding with Si nanoadhesive layer.","PeriodicalId":198318,"journal":{"name":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"LNOI photonics fabricated on Si wafer by room temperature bonding\",\"authors\":\"Kaname Watanabe, Yuya Yamaguchi, A. Kanno, R. Takigawa\",\"doi\":\"10.1109/LTB-3D53950.2021.9598368\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Room temperature bonding is essential for wafer-level heterogeneous integration of LiNbO3-on-insulator (LNOI) photonics to Si. This paper reports first demonstration of thin film LNOI optical modulator arrays fabricated on Si wafer by room-temperature wafer bonding with Si nanoadhesive layer.\",\"PeriodicalId\":198318,\"journal\":{\"name\":\"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/LTB-3D53950.2021.9598368\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LTB-3D53950.2021.9598368","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

室温键合对于LiNbO3-on-insulator (LNOI)光子学与Si的晶圆级非均质集成是必不可少的。本文首次在硅片上用硅纳米胶粘剂层室温键合制备了薄膜LNOI光调制器阵列。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

LNOI photonics fabricated on Si wafer by room temperature bonding

Room temperature bonding is essential for wafer-level heterogeneous integration of LiNbO3-on-insulator (LNOI) photonics to Si. This paper reports first demonstration of thin film LNOI optical modulator arrays fabricated on Si wafer by room-temperature wafer bonding with Si nanoadhesive layer.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

自引率

0.00%

发文量